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Description
Buck converters are a class of switched-mode power converters often used to step down DC input voltages to a lower DC output voltage. These converters naturally produce a current and voltage ripple at their output due to their switching action. Traditional methods of reducing this ripple have involved adding large

Buck converters are a class of switched-mode power converters often used to step down DC input voltages to a lower DC output voltage. These converters naturally produce a current and voltage ripple at their output due to their switching action. Traditional methods of reducing this ripple have involved adding large discrete inductors and capacitors to filter the ripple, but large discrete components cannot be integrated onto chips. As an alternative to using passive filtering components, this project investigates the use of active ripple cancellation to reduce the peak output ripple. Hysteretic controlled buck converters were chosen for their simplicity of design and fast transient response. The proposed cancellation circuits sense the output ripple of the buck converter and inject an equal ripple exactly out of phase with the sensed ripple. Both current-mode and voltage-mode feedback loops are simulated, and the effectiveness of each cancellation circuit is examined. Results show that integrated active ripple cancellation circuits offer a promising substitute for large discrete filters.
ContributorsWang, Ziyan (Author) / Bakkaloglu, Bertan (Thesis director) / Kitchen, Jennifer (Committee member) / Electrical Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2017-12
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Description
This thesis outlines the hand-held memory characterization testing system that is to be created into a PCB (printed circuit board). The circuit is designed to apply voltages diagonally through a RRAM cell (32x32 memory array). The purpose of this sweep across the RRAM is to measure and calculate the high

This thesis outlines the hand-held memory characterization testing system that is to be created into a PCB (printed circuit board). The circuit is designed to apply voltages diagonally through a RRAM cell (32x32 memory array). The purpose of this sweep across the RRAM is to measure and calculate the high and low resistance state value over a specified amount of testing cycles. With each cell having a unique output of high and low resistance states a unique characterization of each RRAM cell is able to be developed. Once the memory is characterized, the specific RRAM cell that was tested is then able to be used in a varying amount of applications for different things based on its uniqueness. Due to an inability to procure a packaged RRAM cell, a Mock-RRAM was instead designed in order to emulate the same behavior found in a RRAM cell.
The final testing circuit and Mock-RRAM are varied and complex but come together to be able to produce a measured value of the high resistance and low resistance state. This is done by the Arduino autonomously digitizing the anode voltage, cathode voltage, and output voltage. A ramp voltage that sweeps from 1V to -1V is applied to the Mock-RRAM acting as an input. This ramp voltage is then later defined as the anode voltage which is just one of the two nodes connected to the Mock-RRAM. The cathode voltage is defined as the other node at which the voltage drops across the Mock-RRAM. Using these three voltages as input to the Arduino, the Mock-RRAM path resistance is able to be calculated at any given point in time. Conducting many test cycles and calculating the high and low resistance values allows for a graph to be developed of the chaotic variation of resistance state values over time. This chaotic variation can then be analyzed further in the future in order to better predict trends and characterize the RRAM cell that was tested.
Furthermore, the interchangeability of many devices on the PCB allows for the testing system to do more in the future. Ports have been added to the final PCB in order to connect a packaged RRAM cell. This will allow for the characterization of a real RRAM memory cell later down the line rather than a Mock-RRAM as emulation. Due to the autonomous testing, very few human intervention is needed which makes this board a great baseline for others in the future looking to add to it and collect larger pools of data.
ContributorsDobrin, Ryan Christopher (Co-author) / Halden, Matthew (Co-author) / Hall, Tanner (Co-author) / Barnaby, Hugh (Thesis director) / Kitchen, Jennifer (Committee member) / Electrical Engineering Program (Contributor, Contributor) / Barrett, The Honors College (Contributor)
Created2019-05
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Description
Readout Integrated Circuits(ROICs) are important components of infrared(IR) imag

ing systems. Performance of ROICs affect the quality of images obtained from IR

imaging systems. Contemporary infrared imaging applications demand ROICs that

can support large dynamic range, high frame rate, high output data rate, at low

cost, size and power. Some of these applications are

Readout Integrated Circuits(ROICs) are important components of infrared(IR) imag

ing systems. Performance of ROICs affect the quality of images obtained from IR

imaging systems. Contemporary infrared imaging applications demand ROICs that

can support large dynamic range, high frame rate, high output data rate, at low

cost, size and power. Some of these applications are military surveillance, remote

sensing in space and earth science missions and medical diagnosis. This work focuses

on developing a ROIC unit cell prototype for National Aeronautics and Space Ad

ministration(NASA), Jet Propulsion Laboratory’s(JPL’s) space applications. These

space applications also demand high sensitivity, longer integration times(large well

capacity), wide operating temperature range, wide input current range and immunity

to radiation events such as Single Event Latchup(SEL).

This work proposes a digital ROIC(DROIC) unit cell prototype of 30ux30u size,

to be used mainly with NASA JPL’s High Operating Temperature Barrier Infrared

Detectors(HOT BIRDs). Current state of the art DROICs achieve a dynamic range

of 16 bits using advanced 65-90nm CMOS processes which adds a lot of cost overhead.

The DROIC pixel proposed in this work uses a low cost 180nm CMOS process and

supports a dynamic range of 20 bits operating at a low frame rate of 100 frames per

second(fps), and a dynamic range of 12 bits operating at a high frame rate of 5kfps.

The total electron well capacity of this DROIC pixel is 1.27 billion electrons, enabling

integration times as long as 10ms, to achieve better dynamic range. The DROIC unit

cell uses an in-pixel 12-bit coarse ADC and an external 8-bit DAC based fine ADC.

The proposed DROIC uses layout techniques that make it immune to radiation up to

300krad(Si) of total ionizing dose(TID) and single event latch-up(SEL). It also has a

wide input current range from 10pA to 1uA and supports detectors operating from

Short-wave infrared (SWIR) to longwave infrared (LWIR) regions.
ContributorsPraveen, Subramanya Chilukuri (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kitchen, Jennifer (Committee member) / Long, Yu (Committee member) / Arizona State University (Publisher)
Created2019