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Creators: Simonson, Mark

Company X Digital Education Thesis Project

Description

This paper goes does a market analysis on Inter Active Flat Panel Displays (IFPDs), and talks about how company X can grow its market share in IFPDs.

ContributorsKoroli, Eri (Co-author) / Phillips, Maya (Co-author) / Morales, Herwin (Co-author) / Hauck, Tanner (Co-author) / Simonson, Mark (Thesis director) / Hertzel, Michael (Committee member) / School of Accountancy (Contributor) / Department of Finance (Contributor) / Department of Information Systems (Contributor) / Barrett, The Honors College (Contributor)

Created2021-05

Substrate Industry Dynamics and Price Implications

Description

This paper serves as an analysis of the current operational conditions of a real-world company – referred to as “Company X” – with respect to the IC substrate industry. The cost of substrates, a crucial component in the production of Company X’s product, has recently diverged from Company X’s predictions and is contributing to declining profitability. This analysis aims to discover the underlying cause for price divergence and recommend potential resolutions to improve the forecast of substrate costs and profitability. The paper is organized as follows: Chapter 1 is an introduction to IC substrates and the industry as a whole, Chapter 2 is a breakdown of the specific factors responsible for substrate prices, and Chapter 3 delivers a final recommendation to Company X and concludes the paper.

ContributorsO'Loughlin, Connor (Author) / Fares, Ari (Co-author) / Aggarwal, Bianca (Co-author) / King, Camden (Co-author) / Guillaume, Riley (Co-author) / Simonson, Mark (Thesis director) / Hertzel, Mike (Committee member) / Barrett, The Honors College (Contributor) / Department of Finance (Contributor) / School of Mathematical and Statistical Sciences (Contributor)

Created2023-05

Company X Collaborative Thesis Program

Description

Due to the high level of competition within the semiconductor industry, companies are looking to identify potential advantages in their manufacturing processes. This paper attempts to discover when it is more cost effective to disaggregate die versus maintaining a monolithic production process. Additionally, it will examine the current conditions of the market and how the results yielded from the research could be applied most effectively. Company X needs to maintain the same or more cores on their processors to stay ahead of their competition. This means that more surface area is needed on the silicon die, encouraging the change to die disaggregation and advanced packaging solutions. In the paper, we will first provide an analysis and go through our two cost equations for monolithic and disaggregated die. We will then break down each part of our cost equations and each variable that goes into it by doing a sensitivity analysis. The sensitivity analysis will give us some insight into which variables are affecting our cost equation the most, and thus which variables Company X should pay the most attention to while deciding whether or not to continue to use the monolithic die or move to the disaggregated process. Based on our findings we came to the conclusion that Company X should continue to utilize a monolithic die for all mobile products. However, all desktop and server products should start to consider utilizing a disaggregated die on a case by case basis while examining the specific factors in the cost equation.

ContributorsKuebler, Mason (Author) / Simonson, Mark (Thesis director) / Llazani, Loris (Committee member) / Department of Finance (Contributor) / Barrett, The Honors College (Contributor)

Created2019-05