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Description
The space environment comprises cosmic ray particles, heavy ions and high energy electrons and protons. Microelectronic circuits used in space applications such as satellites and space stations are prone to upsets induced by these particles. With transistor dimensions shrinking due to continued scaling, terrestrial integrated circuits are also increasingly susceptible

The space environment comprises cosmic ray particles, heavy ions and high energy electrons and protons. Microelectronic circuits used in space applications such as satellites and space stations are prone to upsets induced by these particles. With transistor dimensions shrinking due to continued scaling, terrestrial integrated circuits are also increasingly susceptible to radiation upsets. Hence radiation hardening is a requirement for microelectronic circuits used in both space and terrestrial applications.

This work begins by exploring the different radiation hardened flip-flops that have been proposed in the literature and classifies them based on the different hardening techniques.

A reduced power delay element for the temporal hardening of sequential digital circuits is presented. The delay element single event transient tolerance is demonstrated by simulations using it in a radiation hardened by design master slave flip-flop (FF). Using the proposed delay element saves up to 25% total FF power at 50% activity factor. The delay element is used in the implementation of an 8-bit, 8051 designed in the TSMC 130 nm bulk CMOS.

A single impinging ionizing radiation particle is increasingly likely to upset multiple circuit nodes and produce logic transients that contribute to the soft error rate in most modern scaled process technologies. The design of flip-flops is made more difficult with increasing multi-node charge collection, which requires that charge storage and other sensitive nodes be separated so that one impinging radiation particle does not affect redundant nodes simultaneously. We describe a correct-by-construction design methodology to determine a-priori which hardened FF nodes must be separated, as well as a general interleaving scheme to achieve this separation. We apply the methodology to radiation hardened flip-flops and demonstrate optimal circuit physical organization for protection against multi-node charge collection.

Finally, the methodology is utilized to provide critical node separation for a new hardened flip-flop design that reduces the power and area by 31% and 35% respectively compared to a temporal FF with similar hardness. The hardness is verified and compared to other published designs via the proposed systematic simulation approach that comprehends multiple node charge collection and tests resiliency to upsets at all internal and input nodes. Comparison of the hardness, as measured by estimated upset cross-section, is made to other published designs. Additionally, the importance of specific circuit design aspects to achieving hardness is shown.
ContributorsShambhulingaiah, Sandeep (Author) / Clark, Lawrence (Thesis advisor) / Holbert, Keith E. (Committee member) / Seo, Jae sun (Committee member) / Allee, David (Committee member) / Arizona State University (Publisher)
Created2015
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Description
Imaging using electric fields could provide a cheaper, safer, and easier alternative to the standard methods used for imaging. The viability of electric field imaging at very low frequencies using D-dot sensors has already been investigated and proven. The new goal is to determine if imaging is viable at high

Imaging using electric fields could provide a cheaper, safer, and easier alternative to the standard methods used for imaging. The viability of electric field imaging at very low frequencies using D-dot sensors has already been investigated and proven. The new goal is to determine if imaging is viable at high frequencies. In order to accomplish this, the operational amplifiers used in the very low frequency imaging test set up must be replaced with ones that have higher bandwidth. The trade-off of using these amplifiers is that they have a typical higher input leakage current on the order of 100 compared to the standard. Using a modified circuit design technique that reduces input leakage current of the operational amplifiers used in the imaging test setup, a printed circuit board with D-dot sensors is fabricated to identify the frequency limitations of electric field imaging. Data is collected at both low and high frequencies as well as low peak voltage. The data is then analyzed to determine the range in intensity of electric field and frequency that this circuit low-leakage design can accurately detect a signal. Data is also collected using another printed circuit board that uses the standard circuit design technique. The data taken from the different boards is compared to identify if the modified circuit design technique allows for higher sensitivity imaging. In conclusion, this research supports that using low-leakage design techniques can allow for signal detection comparable to that of the standard circuit design. The low-leakage design allowed for sensitivity within a factor two to that of the standard design. Although testing at higher frequencies was limited, signal detection for the low-leakage design was reliable up until 97 kHz, but further experimentation is needed to determine the upper frequency limits.
ContributorsLin, Richard (Co-author) / Angell, Tyler (Co-author) / Allee, David (Thesis director) / Chung, Hugh (Committee member) / Electrical Engineering Program (Contributor) / W. P. Carey School of Business (Contributor) / Barrett, The Honors College (Contributor)
Created2016-12
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Description
Radiation hardening by design (RHBD) has become a necessary practice when creating circuits to operate within radiated environments. While employing RHBD techniques has tradeoffs between size, speed and power, novel designs help to minimize these penalties. Space radiation is the primary source of radiation errors in circuits and two types

Radiation hardening by design (RHBD) has become a necessary practice when creating circuits to operate within radiated environments. While employing RHBD techniques has tradeoffs between size, speed and power, novel designs help to minimize these penalties. Space radiation is the primary source of radiation errors in circuits and two types of single event effects, single event upsets (SEU), and single event transients (SET) are increasingly becoming a concern. While numerous methods currently exist to nullify SEUs and SETs, special consideration to the techniques of temporal hardening and interlocking are explored in this thesis. Temporal hardening mitigates both SETs and SEUs by spacing critical nodes through the use of delay elements, thus allowing collected charge to be removed. Interlocking creates redundant nodes to rectify charge collection on one single node. This thesis presents an innovative, temporally hardened D flip-flop (TFF). The TFF physical design is laid out in the 130 nm TSMC process in the form of an interleaved multi-bit cell and the circuitry necessary for the flip-flop to be hardened against SETs and SEUs is analyzed with simulations verifying these claims. Comparisons are made to an unhardened D flip-flop through speed, size, and power consumption depicting how the RHBD technique used increases all three over an unhardened flip-flop. Finally, the blocks from both the hardened and the unhardened flip-flops being placed in Synthesis and auto-place and route (APR) design flows are compared through size and speed to show the effects of using the high density multi-bit layout. Finally, the TFF presented in this thesis is compared to two other flip-flops, the majority voter temporal/DICE flip-flop (MTDFF) and the C-element temporal/DICE flip-flop (CTDFF). These circuits are built on the same 130 nm TSMC process as the TFF and then analyzed by the same methods through speed, size, and power consumption and compared to the TFF and unhardened flip-flops. Simulations are completed on the MTDFF and CTDFF to show their strengths against D node SETs and SEUs as well as their weakness against CLK node SETs. Results show that the TFF is faster and harder than both the MTDFF and CTDFF.
ContributorsMatush, Bradley (Author) / Clark, Lawrence T (Thesis advisor) / Allee, David (Committee member) / Bakkaloglu, Bertan (Committee member) / Arizona State University (Publisher)
Created2010
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Description
Readout Integrated Circuits(ROICs) are important components of infrared(IR) imag

ing systems. Performance of ROICs affect the quality of images obtained from IR

imaging systems. Contemporary infrared imaging applications demand ROICs that

can support large dynamic range, high frame rate, high output data rate, at low

cost, size and power. Some of these applications are

Readout Integrated Circuits(ROICs) are important components of infrared(IR) imag

ing systems. Performance of ROICs affect the quality of images obtained from IR

imaging systems. Contemporary infrared imaging applications demand ROICs that

can support large dynamic range, high frame rate, high output data rate, at low

cost, size and power. Some of these applications are military surveillance, remote

sensing in space and earth science missions and medical diagnosis. This work focuses

on developing a ROIC unit cell prototype for National Aeronautics and Space Ad

ministration(NASA), Jet Propulsion Laboratory’s(JPL’s) space applications. These

space applications also demand high sensitivity, longer integration times(large well

capacity), wide operating temperature range, wide input current range and immunity

to radiation events such as Single Event Latchup(SEL).

This work proposes a digital ROIC(DROIC) unit cell prototype of 30ux30u size,

to be used mainly with NASA JPL’s High Operating Temperature Barrier Infrared

Detectors(HOT BIRDs). Current state of the art DROICs achieve a dynamic range

of 16 bits using advanced 65-90nm CMOS processes which adds a lot of cost overhead.

The DROIC pixel proposed in this work uses a low cost 180nm CMOS process and

supports a dynamic range of 20 bits operating at a low frame rate of 100 frames per

second(fps), and a dynamic range of 12 bits operating at a high frame rate of 5kfps.

The total electron well capacity of this DROIC pixel is 1.27 billion electrons, enabling

integration times as long as 10ms, to achieve better dynamic range. The DROIC unit

cell uses an in-pixel 12-bit coarse ADC and an external 8-bit DAC based fine ADC.

The proposed DROIC uses layout techniques that make it immune to radiation up to

300krad(Si) of total ionizing dose(TID) and single event latch-up(SEL). It also has a

wide input current range from 10pA to 1uA and supports detectors operating from

Short-wave infrared (SWIR) to longwave infrared (LWIR) regions.
ContributorsPraveen, Subramanya Chilukuri (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kitchen, Jennifer (Committee member) / Long, Yu (Committee member) / Arizona State University (Publisher)
Created2019