Matching Items (5)
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- All Subjects: Materials Science
- Genre: Masters Thesis
Description
ABSTRACT Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of more transistors, higher power, smaller size, lighter weight and even bendability, thermal management of these devices became one of the key challenges. Compared to active heat management system, heat pipe, which is a passive fluidic system, is considered promising to solve this problem. However, traditional heat pipes have size, weight and capillary limitation. Thus new type of heat pipe with smaller size, lighter weight and higher capillary pressure is needed. Nanofiber has been proved with superior properties and has been applied in multiple areas. This study discussed the possibility of applying nanofiber in heat pipe as new wick structure. In this study, a needleless electrospinning device with high productivity rate was built onsite to systematically investigate the effect of processing parameters on fiber properties as well as to generate nanofiber mat to evaluate its capability in electronics cooling. Polyethylene oxide (PEO) and Polyvinyl Alcohol (PVA) nanofibers were generated. Tensiometer was used for wettability measurement. The results show that independent parameters including spinneret type, working distance, solution concentration and polymer type are strongly correlated with fiber morphology compared to other parameters. The results also show that the fabricated nanofiber mat has high capillary pressure.
ContributorsSun, Tianwei (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongyu (Committee member) / Chen, Kangping (Committee member) / Arizona State University (Publisher)
Created2014
Description
Increasing demand for high strength powder metallurgy (PM) steels has resulted in the development of dual phase PM steels. In this work, the effects of thermal aging on the microstructure and mechanical behavior of dual phase precipitation hardened powder metallurgy (PM) stainless steels of varying ferrite-martensite content were examined. Quantitative analyses of the inherent porosity and phase fractions were conducted on the steels and no significant differences were noted with respect to aging temperature. Tensile strength, yield strength, and elongation to fracture all increased with increasing aging temperature reaching maxima at 538oC in most cases. Increased strength and decreased ductility were observed in steels of higher martensite content. Nanoindentation of the individual microconstituents was employed to obtain a fundamental understanding of the strengthening contributions. Both the ferrite and martensite hardness values increased with aging temperature and exhibited similar maxima to the bulk tensile properties. Due to the complex non-uniform stresses and strains associated with conventional nanoindentation, micropillar compression has become an attractive method to probe local mechanical behavior while limiting strain gradients and contributions from surrounding features. In this study, micropillars of ferrite and martensite were fabricated by focused ion beam (FIB) milling of dual phase precipitation hardened powder metallurgy (PM) stainless steels. Compression testing was conducted using a nanoindenter equipped with a flat punch indenter. The stress-strain curves of the individual microconstituents were calculated from the load-displacement curves less the extraneous displacements of the system. Using a rule of mixtures approach in conjunction with porosity corrections, the mechanical properties of ferrite and martensite were combined for comparison to tensile tests of the bulk material, and reasonable agreement was found for the ultimate tensile strength. Micropillar compression experiments of both as sintered and thermally aged material allowed for investigation of the effect of thermal aging.
ContributorsStewart, Jennifer (Author) / Chawla, Nikhilesh (Thesis advisor) / Jiang, Hanqing (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2011
Description
In this research work, the process optimization of silver iodide-silver meta phosphate ionic glass molding for solid state super ionic stamping was performed. Solid state super ionic stamping is a process of all solid ambient condition electrochemical nano patterning technique. In solid state super ionic stamping, anodic dissolution on a solid electrolyte –metal interface and subsequent charge-mass transport in the solid electrolyte is used for obtaining nanometer features on the metallic surface. The solid electrolyte referred to as the stamp is pre-patterned with features to be obtained on the metallic surface. This research developed the process for obtaining stamp with specific dimensions by making use of compression molding. The compression molding process was optimized by varying the five process parameters-temperature, pressure, holding time, pressing time and cooling time. The objective of the process optimization was to obtain best geometrical features for the stamp including flatness and surface roughness and by optimizing the compression molding process, stamp with minimum flatness and surface roughness was obtained. After the experimental optimization of the process was completed, statistical analysis was performed to understand the relative significance of the process parameters and the interaction of the process parameters on the flatness and surface roughness values of the molded stamp. Structural characterization was performed to obtain the variation of average domain size of ionic glass particles within the molded glass disk by varying the process parameters of holding time, pressing time and cooling time.
ContributorsPanikkar, Gautam (Author) / Hsu, Keng H (Thesis advisor) / Chan, Candace (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2015
Description
A method for modelling the interactions of dislocations with inclusions has been developed to analyse toughening mechanisms in alloys. This method is different from the superposition method in that infinite domain solutions and image stress fields are not superimposed. The method is based on the extended finite element method (XFEM) in which the dislocations are modelled according to the Volterra dislocation model. Interior discontinuities are introduced across dislocation glide planes using enrichment functions and the resulting boundary value problem is solved through the standard finite element variational approach. The level set method is used to describe the geometry of the dislocation glide planes without any explicit treatment of the interface geometry which provides a convenient and an appealing means for describing the dislocation. A method for estimating the Peach-Koehler force by the domain form of J-integral is considered. The convergence and accuracy of the method are studied for an edge dislocation interacting with a free surface where analytical solutions are available. The force converges to the exact solution at an optimal rate for linear finite elements. The applicability of the method to dislocation interactions with inclusions is illustrated with a system of Aluminium matrix containing Aluminium-copper precipitates. The effect of size, shape and orientation of the inclusions on an edge dislocation for a difference in stiffness and coefficient of thermal expansion of the inclusions and matrix is considered. The force on the dislocation due to a hard inclusion increased by 8% in approaching the sharp corners of a square inclusion than a circular inclusion of equal area. The dislocation experienced 24% more force in moving towards the edges of a square shaped inclusion than towards its centre. When the areas of the inclusions were halved, 30% less force was exerted on the dislocation. This method was used to analyse interfaces with mismatch strains. Introducing eigenstrains equal to 0.004 to the elastic mismatch increased the force by 15 times for a circular inclusion. The energy needed to move an edge dislocation through a domain filled with circular inclusions is 4% more than that needed for a domain with square shaped inclusions.
ContributorsVeeresh, Pawan (Author) / Oswald, Jay (Thesis advisor) / Jiang, Hanqing (Committee member) / Liu, Yongming (Committee member) / Arizona State University (Publisher)
Created2016
Description
Flexible conducting materials have been in the forefront of a rapidly transforming electronics industry, focusing on wearable devices for a variety of applications in recent times. Over the past few decades, bulky, rigid devices have been replaced with a surging demand for thin, flexible, light weight, ultra-portable yet high performance electronics. The interconnects available in the market today only satisfy a few of the desirable characteristics, making it necessary to compromise one feature over another. In this thesis, a method to prepare a thin, flexible, and stretchable inter-connect is presented with improved conductivity compared to previous achievements. It satisfies most mechanical and electrical conditions desired in the wearable electronics industry. The conducting composite, prepared with the widely available, low cost silicon-based organic polymer - polydimethylsiloxane (PDMS) and silver (Ag), is sandwiched between two cured PDMS layers. These protective layers improve the mechanical stability of the inter-connect. The structure can be stretched up to 120% of its original length which can further be enhanced to over 250% by cutting it into a serpentine shape without compromising its electrical stability. The inter-connect, around 500 µm thick, can be integrated into thin electronic packaging. The synthesis process of the composite material, along with its electrical and mechanical and properties are presented in detail. Testing methods and results for mechanical and electrical stability are also illustrated over extensive flexing and stretching cycles. The materials put into test, along with conductive silver (Ag) - polydimethylsiloxane (PDMS) composite in a sandwich structure, are copper foils, copper coated polyimide (PI) and aluminum (Al) coated polyethylene terephthalate (PET).
ContributorsNandy, Mayukh (Author) / Yu, Hongbin (Thesis advisor) / Chan, Candace (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2020