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Description
Efficiency of components is an ever increasing area of importance to portable applications, where a finite battery means finite operating time. Higher efficiency devices need to be designed that don't compromise on the performance that the consumer has come to expect. Class D amplifiers deliver on the goal of increased

Efficiency of components is an ever increasing area of importance to portable applications, where a finite battery means finite operating time. Higher efficiency devices need to be designed that don't compromise on the performance that the consumer has come to expect. Class D amplifiers deliver on the goal of increased efficiency, but at the cost of distortion. Class AB amplifiers have low efficiency, but high linearity. By modulating the supply voltage of a Class AB amplifier to make a Class H amplifier, the efficiency can increase while still maintaining the Class AB level of linearity. A 92dB Power Supply Rejection Ratio (PSRR) Class AB amplifier and a Class H amplifier were designed in a 0.24um process for portable audio applications. Using a multiphase buck converter increased the efficiency of the Class H amplifier while still maintaining a fast response time to respond to audio frequencies. The Class H amplifier had an efficiency above the Class AB amplifier by 5-7% from 5-30mW of output power without affecting the total harmonic distortion (THD) at the design specifications. The Class H amplifier design met all design specifications and showed performance comparable to the designed Class AB amplifier across 1kHz-20kHz and 0.01mW-30mW. The Class H design was able to output 30mW into 16Ohms without any increase in THD. This design shows that Class H amplifiers merit more research into their potential for increasing efficiency of audio amplifiers and that even simple designs can give significant increases in efficiency without compromising linearity.
ContributorsPeterson, Cory (Author) / Bakkaloglu, Bertan (Thesis advisor) / Barnaby, Hugh (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Nonvolatile memory (NVM) technologies have been an integral part of electronic systems for the past 30 years. The ideal non-volatile memory have minimal physical size, energy usage, and cost while having maximal speed, capacity, retention time, and radiation hardness. A promising candidate for next-generation memory is ion-conducting bridging RAM which

Nonvolatile memory (NVM) technologies have been an integral part of electronic systems for the past 30 years. The ideal non-volatile memory have minimal physical size, energy usage, and cost while having maximal speed, capacity, retention time, and radiation hardness. A promising candidate for next-generation memory is ion-conducting bridging RAM which is referred to as programmable metallization cell (PMC), conductive bridge RAM (CBRAM), or electrochemical metallization memory (ECM), which is likely to surpass flash memory in all the ideal memory characteristics. A comprehensive physics-based model is needed to completely understand PMC operation and assist in design optimization.

To advance the PMC modeling effort, this thesis presents a precise physical model parameterizing materials associated with both ion-rich and ion-poor layers of the PMC's solid electrolyte, so that captures the static electrical behavior of the PMC in both its low-resistance on-state (LRS) and high resistance off-state (HRS). The experimental data is measured from a chalcogenide glass PMC designed and manufactured at ASU. The static on- and off-state resistance of a PMC device composed of a layered (Ag-rich/Ag-poor) Ge30Se70 ChG film is characterized and modeled using three dimensional simulation code written in Silvaco Atlas finite element analysis software. Calibrating the model to experimental data enables the extraction of device parameters such as material bandgaps, workfunctions, density of states, carrier mobilities, dielectric constants, and affinities.

The sensitivity of our modeled PMC to the variation of its prominent achieved material parameters is examined on the HRS and LRS impedance behavior.

The obtained accurate set of material parameters for both Ag-rich and Ag-poor ChG systems and process variation verification on electrical characteristics enables greater fidelity in PMC device simulation, which significantly enhances our ability to understand the underlying physics of ChG-based resistive switching memory.
ContributorsRajabi, Saba (Author) / Barnaby, Hugh (Thesis advisor) / Kozicki, Michael (Committee member) / Vasileska, Dragica (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Static CMOS logic has remained the dominant design style of digital systems for

more than four decades due to its robustness and near zero standby current. Static

CMOS logic circuits consist of a network of combinational logic cells and clocked sequential

elements, such as latches and flip-flops that are used for sequencing computations

over

Static CMOS logic has remained the dominant design style of digital systems for

more than four decades due to its robustness and near zero standby current. Static

CMOS logic circuits consist of a network of combinational logic cells and clocked sequential

elements, such as latches and flip-flops that are used for sequencing computations

over time. The majority of the digital design techniques to reduce power, area, and

leakage over the past four decades have focused almost entirely on optimizing the

combinational logic. This work explores alternate architectures for the flip-flops for

improving the overall circuit performance, power and area. It consists of three main

sections.

First, is the design of a multi-input configurable flip-flop structure with embedded

logic. A conventional D-type flip-flop may be viewed as realizing an identity function,

in which the output is simply the value of the input sampled at the clock edge. In

contrast, the proposed multi-input flip-flop, named PNAND, can be configured to

realize one of a family of Boolean functions called threshold functions. In essence,

the PNAND is a circuit implementation of the well-known binary perceptron. Unlike

other reconfigurable circuits, a PNAND can be configured by simply changing the

assignment of signals to its inputs. Using a standard cell library of such gates, a technology

mapping algorithm can be applied to transform a given netlist into one with

an optimal mixture of conventional logic gates and threshold gates. This approach

was used to fabricate a 32-bit Wallace Tree multiplier and a 32-bit booth multiplier

in 65nm LP technology. Simulation and chip measurements show more than 30%

improvement in dynamic power and more than 20% reduction in core area.

The functional yield of the PNAND reduces with geometry and voltage scaling.

The second part of this research investigates the use of two mechanisms to improve

the robustness of the PNAND circuit architecture. One is the use of forward and reverse body biases to change the device threshold and the other is the use of RRAM

devices for low voltage operation.

The third part of this research focused on the design of flip-flops with non-volatile

storage. Spin-transfer torque magnetic tunnel junctions (STT-MTJ) are integrated

with both conventional D-flipflop and the PNAND circuits to implement non-volatile

logic (NVL). These non-volatile storage enhanced flip-flops are able to save the state of

system locally when a power interruption occurs. However, manufacturing variations

in the STT-MTJs and in the CMOS transistors significantly reduce the yield, leading

to an overly pessimistic design and consequently, higher energy consumption. A

detailed analysis of the design trade-offs in the driver circuitry for performing backup

and restore, and a novel method to design the energy optimal driver for a given yield is

presented. Efficient designs of two nonvolatile flip-flop (NVFF) circuits are presented,

in which the backup time is determined on a per-chip basis, resulting in minimizing

the energy wastage and satisfying the yield constraint. To achieve a yield of 98%,

the conventional approach would have to expend nearly 5X more energy than the

minimum required, whereas the proposed tunable approach expends only 26% more

energy than the minimum. A non-volatile threshold gate architecture NV-TLFF are

designed with the same backup and restore circuitry in 65nm technology. The embedded

logic in NV-TLFF compensates performance overhead of NVL. This leads to the

possibility of zero-overhead non-volatile datapath circuits. An 8-bit multiply-and-

accumulate (MAC) unit is designed to demonstrate the performance benefits of the

proposed architecture. Based on the results of HSPICE simulations, the MAC circuit

with the proposed NV-TLFF cells is shown to consume at least 20% less power and

area as compared to the circuit designed with conventional DFFs, without sacrificing

any performance.
ContributorsYang, Jinghua (Author) / Vrudhula, Sarma (Thesis advisor) / Barnaby, Hugh (Committee member) / Cao, Yu (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2018
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Description
The rapid improvement in computation capability has made deep convolutional neural networks (CNNs) a great success in recent years on many computer vision tasks with significantly improved accuracy. During the inference phase, many applications demand low latency processing of one image with strict power consumption requirement, which reduces the efficiency

The rapid improvement in computation capability has made deep convolutional neural networks (CNNs) a great success in recent years on many computer vision tasks with significantly improved accuracy. During the inference phase, many applications demand low latency processing of one image with strict power consumption requirement, which reduces the efficiency of GPU and other general-purpose platform, bringing opportunities for specific acceleration hardware, e.g. FPGA, by customizing the digital circuit specific for the deep learning algorithm inference. However, deploying CNNs on portable and embedded systems is still challenging due to large data volume, intensive computation, varying algorithm structures, and frequent memory accesses. This dissertation proposes a complete design methodology and framework to accelerate the inference process of various CNN algorithms on FPGA hardware with high performance, efficiency and flexibility.

As convolution contributes most operations in CNNs, the convolution acceleration scheme significantly affects the efficiency and performance of a hardware CNN accelerator. Convolution involves multiply and accumulate (MAC) operations with four levels of loops. Without fully studying the convolution loop optimization before the hardware design phase, the resulting accelerator can hardly exploit the data reuse and manage data movement efficiently. This work overcomes these barriers by quantitatively analyzing and optimizing the design objectives (e.g. memory access) of the CNN accelerator based on multiple design variables. An efficient dataflow and hardware architecture of CNN acceleration are proposed to minimize the data communication while maximizing the resource utilization to achieve high performance.

Although great performance and efficiency can be achieved by customizing the FPGA hardware for each CNN model, significant efforts and expertise are required leading to long development time, which makes it difficult to catch up with the rapid development of CNN algorithms. In this work, we present an RTL-level CNN compiler that automatically generates customized FPGA hardware for the inference tasks of various CNNs, in order to enable high-level fast prototyping of CNNs from software to FPGA and still keep the benefits of low-level hardware optimization. First, a general-purpose library of RTL modules is developed to model different operations at each layer. The integration and dataflow of physical modules are predefined in the top-level system template and reconfigured during compilation for a given CNN algorithm. The runtime control of layer-by-layer sequential computation is managed by the proposed execution schedule so that even highly irregular and complex network topology, e.g. GoogLeNet and ResNet, can be compiled. The proposed methodology is demonstrated with various CNN algorithms, e.g. NiN, VGG, GoogLeNet and ResNet, on two different standalone FPGAs achieving state-of-the art performance.

Based on the optimized acceleration strategy, there are still a lot of design options, e.g. the degree and dimension of computation parallelism, the size of on-chip buffers, and the external memory bandwidth, which impact the utilization of computation resources and data communication efficiency, and finally affect the performance and energy consumption of the accelerator. The large design space of the accelerator makes it impractical to explore the optimal design choice during the real implementation phase. Therefore, a performance model is proposed in this work to quantitatively estimate the accelerator performance and resource utilization. By this means, the performance bottleneck and design bound can be identified and the optimal design option can be explored early in the design phase.
ContributorsMa, Yufei (Author) / Vrudhula, Sarma (Thesis advisor) / Seo, Jae-Sun (Thesis advisor) / Cao, Yu (Committee member) / Barnaby, Hugh (Committee member) / Arizona State University (Publisher)
Created2018
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Description
Non-volatile memory (NVM) has become a staple in the everyday life of consumers. NVM manifests inside cell phones, laptops, and most recently, wearable tech such as smart watches. NAND Flash has been an excellent solution to conditions requiring fast, compact NVM. Current technology nodes are nearing the physical limits of

Non-volatile memory (NVM) has become a staple in the everyday life of consumers. NVM manifests inside cell phones, laptops, and most recently, wearable tech such as smart watches. NAND Flash has been an excellent solution to conditions requiring fast, compact NVM. Current technology nodes are nearing the physical limits of scaling, preventing flash from improving. To combat the limitations of flash and to appease consumer demand for progressively faster and denser NVM, new technologies are needed. One possible candidate for the replacement of NAND Flash is programmable metallization cells (PMC). PMC are a type of resistive memory, meaning that they do not rely on charge storage to maintain a logic state. Depending on their application, it is possible that devices containing NVM will be exposed to harsh radiation environments. As part of the process for developing a novel memory technology, it is important to characterize the effects irradiation has on the functionality of the devices.

This thesis characterizes the effects that ionizing γ-ray irradiation has on the retention of the programmed resistive state of a PMC. The PMC devices tested used Ge30Se70 doped with Ag as the solid electrolyte layer and were fabricated by the thesis author in a Class 100 clean room. Individual device tiles were wire bonded into ceramic packages and tested in a biased and floating contact scenario.

The first scenario presented shows that PMC devices are capable of retaining their programmed state up to the maximum exposed total ionizing dose (TID) of 3.1 Mrad(Si). In this first scenario, the contacts of the PMC devices were left floating during exposure. The second scenario tested shows that the PMC devices are capable of retaining their state until the maximum TID of 10.1 Mrad(Si) was reached. The contacts in the second scenario were biased, with a 50 mV read voltage applied to the anode contact. Analysis of the results show that Ge30Se70 PMC are ionizing radiation tolerant and can retain a programmed state to a higher TID than NAND Flash memory.
ContributorsTaggart, Jennifer Lynn (Author) / Barnaby, Hugh (Thesis advisor) / Kozicki, Michael (Committee member) / Holbert, Keith E. (Committee member) / Arizona State University (Publisher)
Created2015
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Description
Counterfeiting of goods is a widespread epidemic that is affecting the world economy. The conventional labeling techniques are proving inadequate to thwart determined counterfeiters equipped with sophisticated technologies. There is a growing need of a secure labeling that is easy to manufacture and analyze but extremely difficult to copy. Programmable

Counterfeiting of goods is a widespread epidemic that is affecting the world economy. The conventional labeling techniques are proving inadequate to thwart determined counterfeiters equipped with sophisticated technologies. There is a growing need of a secure labeling that is easy to manufacture and analyze but extremely difficult to copy. Programmable metallization cell technology operates on a principle of controllable reduction of a metal ions to an electrodeposit in a solid electrolyte by application of bias. The nature of metallic electrodeposit is unique for each instance of growth, moreover it has a treelike, bifurcating fractal structure with high information capacity. These qualities of the electrodeposit can be exploited to use it as a physical unclonable function. The secure labels made from the electrodeposits grown in radial structure can provide enhanced authentication and protection from counterfeiting and tampering.

So far only microscale radial structures and electrodeposits have been fabricated which limits their use to labeling only high value items due to high cost associated with their fabrication and analysis. Therefore, there is a need for a simple recipe for fabrication of macroscale structure that does not need sophisticated lithography tools and cleanroom environment. Moreover, the growth kinetics and material characteristics of such macroscale electrodeposits need to be investigated. In this thesis, a recipe for fabrication of centimeter scale radial structure for growing Ag electrodeposits using simple fabrication techniques was proposed. Fractal analysis of an electrodeposit suggested information capacity of 1.27 x 1019. The kinetics of growth were investigated by electrical characterization of the full cell and only solid electrolyte at different temperatures. It was found that mass transport of ions is the rate limiting process in the growth. Materials and optical characterization techniques revealed that the subtle relief like structure and consequently distinct optical response of the electrodeposit provides an added layer of security. Thus, the enormous information capacity, ease of fabrication and simplicity of analysis make macroscale fractal electrodeposits grown in radial programmable metallization cells excellent candidates for application as physical unclonable functions.
ContributorsChamele, Ninad (Author) / Kozicki, Michael (Thesis advisor) / Barnaby, Hugh (Thesis advisor) / Newman, Nathan (Committee member) / Arizona State University (Publisher)
Created2017
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Description
Metal-Oxide-Semiconductor (MOS) is essential to modern VLSI devices. In the past decades, a wealth of literature has been created to understand the impact of the radiation-induced charges on the devices, i.e., the creation of electron-hole pairs in the oxide layer which is the most sensitive part of MOS structure to

Metal-Oxide-Semiconductor (MOS) is essential to modern VLSI devices. In the past decades, a wealth of literature has been created to understand the impact of the radiation-induced charges on the devices, i.e., the creation of electron-hole pairs in the oxide layer which is the most sensitive part of MOS structure to the radiation effect. In this work, both MOS and MNOS devices were fabricated at ASU NanoFab to study the total ionizing dose effect using capacitance-voltage (C-V) electrical characterization by observing the direction and amounts of the shift in C-V curves and electron holography observation to directly image the charge buildup at the irradiated oxide film of the oxide-only MOS device.C-V measurements revealed the C-V curves shifted to the left after irradiation (with a positive bias applied) because of the net positive charges trapped at the oxide layer for the oxide-only sample. On the other hand, for nitride/oxide samples with positive biased during irradiation, the C-V curve shifted to the right due to the net negative charges trapped at the oxide layer. It was also observed that the C-V curve has less shift in voltage for MNOS than MOS devices after irradiation due to the less charge buildup after irradiation. Off-axis electron holography was performed to map the charge distribution across the MOSCAP sample. Compared with both pre-and post-irradiated samples, a larger potential drop at the Si/SiO2 was noticed in post-irradiation samples, which indicates the presence of greater amounts of positive charges that buildup the Si/SiO2 interface after the TID exposure. TCAD modeling was used to extract the density of charges accumulated near the SiO2/Si and SiO2/ Metal interface by matching the simulation results to the potential data from holography. The increase of near-interface positive charges in post-irradiated samples is consistent with the C-V results.
ContributorsChang, Ching Tao (Author) / Barnaby, Hugh (Thesis advisor) / Holbert, Keith (Committee member) / Tongay, Sefaattin (Committee member) / Arizona State University (Publisher)
Created2023
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Description
Lateral programmable metallization cells (PMC) utilize the properties of electrodeposits grown over a solid electrolyte channel. Such devices have an active anode and an inert cathode separated by a long electrodeposit channel in a coplanar arrangement. The ability to transport large amount of metallic mass across the channel makes these

Lateral programmable metallization cells (PMC) utilize the properties of electrodeposits grown over a solid electrolyte channel. Such devices have an active anode and an inert cathode separated by a long electrodeposit channel in a coplanar arrangement. The ability to transport large amount of metallic mass across the channel makes these devices attractive for various More-Than-Moore applications. Existing literature lacks a comprehensive study of electrodeposit growth kinetics in lateral PMCs. Moreover, the morphology of electrodeposit growth in larger, planar devices is also not understood. Despite the variety of applications, lateral PMCs are not embraced by the semiconductor industry due to incompatible materials and high operating voltages needed for such devices. In this work, a numerical model based on the basic processes in PMCs – cation drift and redox reactions – is proposed, and the effect of various materials parameters on the electrodeposit growth kinetics is reported. The morphology of the electrodeposit growth and kinetics of the electrodeposition process are also studied in devices based on Ag-Ge30Se70 materials system. It was observed that the electrodeposition process mainly consists of two regimes of growth – cation drift limited regime and mixed regime. The electrodeposition starts in cation drift limited regime at low electric fields and transitions into mixed regime as the field increases. The onset of mixed regime can be controlled by applied voltage which also affects the morphology of electrodeposit growth. The numerical model was then used to successfully predict the device kinetics and onset of mixed regime. The problem of materials incompatibility with semiconductor manufacturing was solved by proposing a novel device structure. A bilayer structure using semiconductor foundry friendly materials was suggested as a candidate for solid electrolyte. The bilayer structure consists of a low resistivity oxide shunt layer on top of a high resistivity ion carrying oxide layer. Devices using Cu2O as the low resistivity shunt on top of Cu doped WO3 oxide were fabricated. The bilayer devices provided orders of magnitude improvement in device performance in the context of operating voltage and switching time. Electrical and materials characterization revealed the structure of bilayers and the mechanism of electrodeposition in these devices.
ContributorsChamele, Ninad (Author) / Kozicki, Michael (Thesis advisor) / Barnaby, Hugh (Committee member) / Newman, Nathan (Committee member) / Gonzalez-Velo, Yago (Committee member) / Arizona State University (Publisher)
Created2020
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Description
Most hardware today is based on von Neumann architecture separating memory from logic. Valuable processing time is lost in shuttling information back and forth between the two units, a problem called von Neumann bottleneck. As transistors are scaled further down, this bottleneck will make it harder to deliver performance in

Most hardware today is based on von Neumann architecture separating memory from logic. Valuable processing time is lost in shuttling information back and forth between the two units, a problem called von Neumann bottleneck. As transistors are scaled further down, this bottleneck will make it harder to deliver performance in computing power. Adding to this is the increasing complexity of artificial intelligence logic. Thus, there is a need for a faster and more efficient method of computing. Neuromorphic systems deliver this by emulating the massively parallel and fault-tolerant computing capabilities of the human brain where the action potential is triggered by multiple inputs at once (spatial) or an input that builds up over time (temporal). Highly scalable memristors are key in these systems- they can maintain their internal resistive state based on previous current/voltage values thus mimicking the way the strength of two synapses in the brain can vary. The brain-inspired algorithms are implemented by vector matrix multiplications (VMMs) to provide neuronal outputs. High-density conductive bridging random access memory (CBRAM) crossbar arrays (CBAs) can perform VMMs parallelly with ultra-low energy.This research explores a simple planarization technique that could be potentially extended to integrate front-end-of-line (FEOL) processing of complementary metal oxide semiconductor (CMOS) circuitry with back-end-of-line (BEOL) processing of CBRAM CBAs for one-transistor one-resistor (1T1R) Neuromorphic CMOS chips where the transistor is part of the CMOS circuitry and the CBRAM forms the resistor. It is a photoresist (PR) and spin-on glass (SOG) based planarization recipe to planarize CBRAM electrode patterns on a silicon substrate. In this research, however, the planarization is only applied to mechanical grade (MG) silicon wafers without any CMOS layers on them. The planarization achieved was of a very high order (few tens of nanometers). Additionally, the recipe is cost-effective, provides good quality films and simple as only two types of process technologies are involved- lithography and dry etching. Subsequent processing would involve depositing the CBRAM layers onto the planarized electrodes to form the resistor. Finally, the entire process flow is to be replicated onto wafers with CMOS layers to form the 1T1R circuit.
ContributorsBiswas, Prabaha (Author) / Barnaby, Hugh (Thesis advisor) / Kozicki, Michael (Committee member) / Velo, Yago Gonzalez (Committee member) / Arizona State University (Publisher)
Created2021