Matching Items (3)
Filtering by
- All Subjects: Materials Science
Description
GaAs-based solar cells have attracted much interest because of their high conversion efficiencies of ~28% under one sun illumination. The main carrier recombination mechanisms in the GaAs-based solar cells are surface recombination, radiative recombination and non-radiative recombination. Photon recycling reduces the effect of radiative recombination and is an approach to obtain the device performance described by detailed balance theory. The photon recycling model has been developed and was applied to investigate the loss mechanisms in the state-of-the-art GaAs-based solar cell structures using PC1D software. A standard fabrication process of the GaAs-based solar cells is as follows: wafer preparation, individual cell isolation by mesa, n- and p-type metallization, rapid thermal annealing (RTA), cap layer etching, and anti-reflection coating (ARC). The growth rate for GaAs-based materials is one of critical factors to determine the cost for the growth of GaAs-based solar cells. The cost for fabricating GaAs-based solar cells can be reduced if the growth rate is increased without degrading the crystalline quality. The solar cell wafers grown at different growth rates of 14 μm/hour and 55 μm/hour were discussed in this work. The structural properties of the wafers were characterized by X-ray diffraction (XRD) to identify the crystalline quality, and then the as-grown wafers were fabricated into solar cell devices under the same process conditions. The optical and electrical properties such as surface reflection, external quantum efficiency (EQE), dark I-V, Suns-Voc, and illuminated I-V under one sun using a solar simulator were measured to compare the performances of the solar cells with different growth rates. Some simulations in PC1D have been demonstrated to investigate the reasons of the different device performances between fast growth and slow growth structures. A further analysis of the minority carrier lifetime is needed to investigate into the difference in device performances.
ContributorsZhang, Chaomin (Author) / Honsberg, Christiana (Thesis advisor) / Goodnick, Stephen (Committee member) / Faleev, Nikolai (Committee member) / Arizona State University (Publisher)
Created2014
Description
Due to the ever increasing relevance of finer machining control as well as necessary reduction in material waste by large area semiconductor device manufacturers, a novel bulk laser machining method was investigated. Because the cost of silicon and sapphire substrates are limiting to the reduction in cost of devices in both the light emitting diode (LED) and solar industries, and the present substrate wafering process results in >50% waste, the need for an improved ingot wafering technique exists.
The focus of this work is the design and understanding of a novel semiconductor wafering technique that utilizes the nonlinear absorption properties of band-gapped materials to achieve bulk (subsurface) morphological changes in matter using highly focused laser light. A method and tool was designed and developed to form controlled damage regions in the bulk of a crystalline sapphire wafer leaving the surfaces unaltered. The controllability of the subsurface damage geometry was investigated, and the effect of numerical aperture of the focusing optic, energy per pulse, wavelength, and number of pulses was characterized for a nanosecond pulse length variable wavelength Nd:YAG OPO laser.
A novel model was developed to describe the geometry of laser induced morphological changes in the bulk of semiconducting materials for nanosecond pulse lengths. The beam propagation aspect of the model was based on ray-optics, and the full Keldysh multiphoton photoionization theory in conjuncture with Thornber's and Drude's models for impact ionization were used to describe high fluence laser light absorption and carrier generation ultimately resulting in permanent material modification though strong electron-plasma absorption and plasma melting. Although the electron-plasma description of laser damage formation is usually reserved for extremely short laser pulses (<20 ps), this work shows that it can be adapted for longer pulses of up to tens of nanoseconds.
In addition to a model describing damage formation of sub-band gap energy laser light in semiconducting and transparent crystalline dielectrics, a novel nanosecond laser process was successfully realized to generate a thin plane of damage in the bulk of sapphire wafers. This was accomplished using high numerical aperture optics, a variable wavelength nanosecond laser source, and three-dimensional motorized precision stage control.
The focus of this work is the design and understanding of a novel semiconductor wafering technique that utilizes the nonlinear absorption properties of band-gapped materials to achieve bulk (subsurface) morphological changes in matter using highly focused laser light. A method and tool was designed and developed to form controlled damage regions in the bulk of a crystalline sapphire wafer leaving the surfaces unaltered. The controllability of the subsurface damage geometry was investigated, and the effect of numerical aperture of the focusing optic, energy per pulse, wavelength, and number of pulses was characterized for a nanosecond pulse length variable wavelength Nd:YAG OPO laser.
A novel model was developed to describe the geometry of laser induced morphological changes in the bulk of semiconducting materials for nanosecond pulse lengths. The beam propagation aspect of the model was based on ray-optics, and the full Keldysh multiphoton photoionization theory in conjuncture with Thornber's and Drude's models for impact ionization were used to describe high fluence laser light absorption and carrier generation ultimately resulting in permanent material modification though strong electron-plasma absorption and plasma melting. Although the electron-plasma description of laser damage formation is usually reserved for extremely short laser pulses (<20 ps), this work shows that it can be adapted for longer pulses of up to tens of nanoseconds.
In addition to a model describing damage formation of sub-band gap energy laser light in semiconducting and transparent crystalline dielectrics, a novel nanosecond laser process was successfully realized to generate a thin plane of damage in the bulk of sapphire wafers. This was accomplished using high numerical aperture optics, a variable wavelength nanosecond laser source, and three-dimensional motorized precision stage control.
ContributorsLeBeau, James (Author) / Bowden, Stuart (Thesis advisor) / Honsberg, Christiana (Committee member) / Bertoni, Mariana (Committee member) / Cotter, Jeffrey (Committee member) / Arizona State University (Publisher)
Created2015
Description
Realization of efficient, high-bandgap photovoltaic cells produced using economically viable methods is a technological advance that could change the way we generate and use energy, and thereby accelerate the development of human civilization. There is a need to engineer a semiconductor material for solar cells, particularly multijunction cells, that has high (1.6-2.0 eV) bandgap, has relatively inactive defects, is thermodynamically stable under normal operating conditions with the potential for cost-effective thin-film growth in mass production.This work focuses on a material system made of gallium, indium, and phosphorus – the ternary semiconductor GaInP. GaInP based photovoltaic cells in single-crystal form have demonstrated excellent power conversion efficiency, however, growth of single-crystal GaInP is prohibitively expensive. While growth of polycrystalline GaInP is expected to lower production costs, polycrystalline GaInP is also expected to have a high density of electronically active defects, about which little is reported in scientific literature. This work presents the first study of synthesis, and structural and optoelectronic characterization of polycrystalline GaInP thin films.
In addition, this work models the best performance of polycrystalline solar cells achievable with a given grain size with grain-boundary/surface recombination velocity as a variable parameter. The effects of defect characteristics at the surface and layer properties such as doping and thickness on interface recombination velocity are also modeled.
Recombination velocities at the free surface of single-crystal GaInP and after deposition of various dielectric layers on GaInP are determined experimentally using time-resolved photoluminescence decay measurements. In addition, experimental values of bulk lifetime and surface recombination velocity in well-passivated single crystal AlInP-GaInP based double heterostructures are also measured for comparison to polycrystalline material systems.
A novel passivation method – aluminum-assisted post-deposition treatment or Al-PDT – was developed which shows promise as a general passivation and material improvement technique for polycrystalline thin films. In the GaInP system, this aluminum post-deposition treatment has demonstrated improvement in the minority carrier lifetime to 44 ns at 80 K. During development of the passivation process, aluminum diffusivity in GaInP was measured using TEM-EDS line scans. Introduction, development, and refinement of this novel passivation mechanism in polycrystalline GaInP could initiate the development of a new family of passivation treatments, potentially improving the optoelectronic response of other polycrystalline compound semiconductors as well.
ContributorsChikhalkar, Abhinav (Author) / King, Richard R (Thesis advisor) / Honsberg, Christiana (Committee member) / Newman, Nathan (Committee member) / Tongay, Sefaattin (Committee member) / Arizona State University (Publisher)
Created2021