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Photovoltaic (PV) module degradation is a well-known issue, however understanding the mechanistic pathways in which modules degrade is still a major task for the PV industry. In order to study the mechanisms responsible for PV module degradation, the effects of these degradation mechanisms must be quantitatively measured to determine the

Photovoltaic (PV) module degradation is a well-known issue, however understanding the mechanistic pathways in which modules degrade is still a major task for the PV industry. In order to study the mechanisms responsible for PV module degradation, the effects of these degradation mechanisms must be quantitatively measured to determine the severity of each degradation mode. In this thesis multiple modules from three climate zones (Arizona, California and Colorado) were investigated for a single module glass/polymer construction (Siemens M55) to determine the degree to which they had degraded, and the main factors that contributed to that degradation. To explain the loss in power, various nondestructive and destructive techniques were used to indicate possible causes of loss in performance. This is a two-part thesis. Part 1 presents non-destructive test results and analysis and Part 2 presents destructive test results and analysis.
ContributorsChicca, Matthew (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Srinivasan, Devarajan (Committee member) / Arizona State University (Publisher)
Created2015
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Description
The microstructure development of Inconel alloy 718 (IN718) during conventional processing has been extensively studied and much has been discovered as to the mechanisms behind the exceptional creep resistance that the alloy exhibits. More recently with the development of large scale 3D printing of alloys such as IN718 a new

The microstructure development of Inconel alloy 718 (IN718) during conventional processing has been extensively studied and much has been discovered as to the mechanisms behind the exceptional creep resistance that the alloy exhibits. More recently with the development of large scale 3D printing of alloys such as IN718 a new dimension of complexity has emerged in the understanding of alloy microstructure development, hence, potential alloy development opportunity for IN718.

This study is a broad stroke at discovering possible alternate microstructures developing in Direct-Metal-Laser-Sintering (DMLS) processed IN718 compared to those in conventional wrought IN718. The main inspiration for this study came from creep test results from several DMLS IN718 samples at Honeywell that showed a significant

improvement in creep capabilities for DMLS718 compared to cast and wrought IN718 (Honeywell).

From this data the steady-state creep rates were evaluated and fitted to current creep models in order to identify active creep mechanisms in conventional and DMLS IN718 and illuminate the potential factors responsible for the improved creep behavior in DMSL processed IN718.

Because rapid heating and cooling can introduce high internal stress and impact microstructural development, such as gamma double prime formations (Oblak et al.), leading to differences in material behavior, DMLS and conventional IN718 materials are studied using SEM and TEM characterization to investigate sub-micron and/or nano-scale

microstructural differences developed in the DMLS samples as a result of their complex thermal history and internal stress.

The preliminary analysis presented in this body of work is an attempt to better understand the effect of DMLS processing in quest for development of optimization techniques for DMLS as a whole. A historical sketch of nickel alloys and the development of IN718 is given. A literature review detailing the microstructure of IN718 is presented. Creep data analysis and identification of active creep mechanisms are evaluated. High-resolution microstructural characterization of DMLS and wrought IN718 are discussed in detail throughout various chapters of this thesis. Finally, an initial effort in developing a processing model that would allow for parameter optimization is presented.
ContributorsRogers, Blake Kenton (Author) / Tasooji, Amaneh (Thesis advisor) / Petuskey, William (Committee member) / Rogers, Bradley (Committee member) / Arizona State University (Publisher)
Created2017
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Description
Electrostatic Discharge (ESD) is a unique issue in the electronics industry that can cause failures of electrical components and complete electronic systems. There is an entire industry that is focused on developing ESD compliant tooling using traditional manufacturing methods. This research work evaluates the feasibility to fabricate a

Electrostatic Discharge (ESD) is a unique issue in the electronics industry that can cause failures of electrical components and complete electronic systems. There is an entire industry that is focused on developing ESD compliant tooling using traditional manufacturing methods. This research work evaluates the feasibility to fabricate a PEEK-Carbon Nanotube composite filament for Fused Filament Fabrication (FFF) Additive Manufacturing that is ESD compliant. In addition, it demonstrates that the FFF process can be used to print tools with the required accuracy, ESD compliance and mechanical properties necessary for the electronics industry at a low rate production level. Current Additive Manufacturing technology can print high temperature polymers, such as PEEK, with the required mechanical properties but they are not ESD compliant and require post processing to create a product that is. There has been some research conducted using mixed multi-wall and single wall carbon nanotubes in a PEEK polymers, which improves mechanical properties while reducing bulk resistance to the levels required to be ESD compliant. This previous research has been used to develop a PEEK-CNT polymer matrix for the Fused Filament Fabrication additive manufacturing process
ContributorsChurchwell, Raymond L (Author) / Sugar, Thomas (Thesis advisor) / Rogers, Bradley (Committee member) / Morrell, Darryl (Committee member) / Arizona State University (Publisher)
Created2020