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Description
Isolated DC/DC converters are used to provide electrical isolation between two supply domain systems. A fully integrated isolated DC/DC converter having no board-level components and fabricated using standard integrated circuits (IC) process is highly desirable in order to increase the system reliability and reduce costs. The isolation between the low-voltage

Isolated DC/DC converters are used to provide electrical isolation between two supply domain systems. A fully integrated isolated DC/DC converter having no board-level components and fabricated using standard integrated circuits (IC) process is highly desirable in order to increase the system reliability and reduce costs. The isolation between the low-voltage side and high-voltage side of the converter is realized by a transformer that transfers energy while blocking the DC loop. The resonant mode power oscillator is used to enable high efficiency power transfer. The on-chip transformer is expected to have high coil inductance, high quality factors and high coupling coefficient to reduce the loss in the oscillation. The performance of a transformer is highly dependent on the vertical structure, horizontal geometry and other indispensable structures that make it compatible with the IC process such as metal fills and patterned ground shield (PGS). With the help of three-dimensional (3-D) electro-magnetic (EM) simulation software, the 3-D transformer model is simulated and the simulation result is got with high accuracy.

In this thesis an on-chip transformer for a fully integrated DC/DC converter using standard IC process is developed. Different types of transformers are modeled and simulated in HFSS. The performances are compared to select the optimum design. The effects of the additional structures including PGS and metal fills are also simulated. The transformer is tested with a network analyzer and the testing results show a good consistency with the simulation results when taking the chip traces, printed circuit board (PCB) traces, bond wires and SMA connectors into account.
ContributorsZhao, Yao (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Negative Bias Temperature Instability (NBTI) is commonly seen in p-channel transistors under negative gate voltages at an elevated temperature. The interface traps, oxide traps and NBTI mechanisms are discussed and their effect on circuit degradation and results are discussed. This thesis focuses on developing a model for simulating impact of

Negative Bias Temperature Instability (NBTI) is commonly seen in p-channel transistors under negative gate voltages at an elevated temperature. The interface traps, oxide traps and NBTI mechanisms are discussed and their effect on circuit degradation and results are discussed. This thesis focuses on developing a model for simulating impact of NBTI effects at circuit level. The model mimics the effects of degradation caused by the defects.

The NBTI model developed in this work is validated and sanity checked by using the simulation data from silvaco and gives excellent results. Furthermore the susceptibility of CMOS circuits such as the CMOS inverter, and a ring oscillator to NBTI is investigated. The results show that the oscillation frequency of a ring oscillator decreases and the SET pulse broadens with the NBTI.
ContributorsPadala, Sudheer (Author) / Barnaby, Hugh (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Power Management circuits are employed in almost all electronic equipment and they have energy storage elements (capacitors and inductors) as building blocks along with other active circuitry. Power management circuits employ feedback to achieve good load and line regulation. The feedback loop is designed at an operating point and component

Power Management circuits are employed in almost all electronic equipment and they have energy storage elements (capacitors and inductors) as building blocks along with other active circuitry. Power management circuits employ feedback to achieve good load and line regulation. The feedback loop is designed at an operating point and component values are chosen to meet that design requirements. But the capacitors and inductors are subject to variations due to temperature, aging and load stress. Due to these variations, the feedback loop can cross its robustness margins and can lead to degraded performance and potential instability. Another issue in power management circuits is the measurement of their frequency response for stability assessment. The standard techniques used in production test environment require expensive measurement equipment (Network Analyzer) and time. These two issues of component variations and frequency response measurement can be addressed if the frequency response of the power converter is used as measure of component (capacitor and inductor) variations. So, a single solution of frequency response measurement solves both the issues. This work examines system identification (frequency response measurement) of power management circuits based on cross correlation technique and proposes the use of switched capacitor correlator for this purpose. A switched capacitor correlator has been designed and used in the system identification of Linear and Switching regulators. The obtained results are compared with the standard frequency response measurement methods of power converters.
ContributorsMalladi, Venkata Naga Koushik (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kitchen, Jennifer (Committee member) / Ogras, Umit Y. (Committee member) / Arizona State University (Publisher)
Created2015
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Description
In competitive Taekwondo, Electronic Body Protectors (EBPs) are used to register hits made by players during sparring. EBPs are comprised of three main components: chest guard, foot sock, and headgear. This equipment interacts with each other through the use of magnets, electric sensors, transmitters, and a receiver. The receiver is

In competitive Taekwondo, Electronic Body Protectors (EBPs) are used to register hits made by players during sparring. EBPs are comprised of three main components: chest guard, foot sock, and headgear. This equipment interacts with each other through the use of magnets, electric sensors, transmitters, and a receiver. The receiver is connected to a computer programmed with software to process signals from the transmitter and determine whether or not a competitor scored a point. The current design of EBPs, however, have numerous shortcomings, including sensing false positives, failing to register hits, costing too much, and relying on human judgment. This thesis will thoroughly delineate the operation of the current EBPs used and discuss research performed in order to eliminate these weaknesses.
ContributorsSpell, Valerie Anne (Author) / Kozicki, Michael (Thesis director) / Kitchen, Jennifer (Committee member) / Electrical Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
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Description
A single solar cell provides close to 0.5 V output at its maximum power point, which is very

low for any electronic circuit to operate. To get rid of this problem, traditionally multiple

solar cells are connected in series to get higher voltage. The disadvantage of this approach

is the efficiency loss for

A single solar cell provides close to 0.5 V output at its maximum power point, which is very

low for any electronic circuit to operate. To get rid of this problem, traditionally multiple

solar cells are connected in series to get higher voltage. The disadvantage of this approach

is the efficiency loss for partial shading or mismatch. Even as low as 6-7% of shading can

result in more than 90% power loss. Therefore, Maximum Power Point Tracking (MPPT)

at single solar cell level is the most efficient way to extract power from solar cell.

Power Management IC (MPIC) used to extract power from single solar cell, needs to

start at 0.3 V input. MPPT circuitry should be implemented with minimal power and area

overhead. To start the PMIC at 0.3 V, a switch capacitor charge pump is utilized as an

auxiliary start up circuit for generating a regulated 1.8 V auxiliary supply from 0.3 V input.

The auxiliary supply powers up a MPPT converter followed by a regulated converter. At

the start up both the converters operate at 100 kHz clock with 80% duty cycle and system

output voltage starts rising. When the system output crosses 2.7 V, the auxiliary start up

circuit is turned off and the supply voltage for both the converters is derived from the system

output itself. In steady-state condition the system output is regulated to 3.0 V.

A fully integrated analog MPPT technique is proposed to extract maximum power from

the solar cell. This technique does not require Analog to Digital Converter (ADC) and

Digital Signal Processor (DSP), thus reduces area and power overhead. The proposed

MPPT techniques includes a switch capacitor based power sensor which senses current of

boost converter without using any sense resistor. A complete system is designed which

starts from 0.3 V solar cell voltage and provides regulated 3.0 V system output.
ContributorsSingh, Shrikant (Author) / Kiaei, Sayfe (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2015
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Description
This dissertation focuses on three different efficiency enhancement methods that are applicable to handset applications. These proposed designs are based on three critical requirements for handset application: 1) Small form factor, 2) CMOS compatibility and 3) high power handling. The three presented methodologies are listed below:

1) A transformer-based power combiner architecture

This dissertation focuses on three different efficiency enhancement methods that are applicable to handset applications. These proposed designs are based on three critical requirements for handset application: 1) Small form factor, 2) CMOS compatibility and 3) high power handling. The three presented methodologies are listed below:

1) A transformer-based power combiner architecture for out-phasing transmitters

2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA)

3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters

This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB.

The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%.

Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.
ContributorsMoallemi, Soroush (Author) / Kitchen, Jennifer (Thesis advisor) / Kiaei, Sayfe (Committee member) / Bakkaloglu, Bertan (Committee member) / Thornton, Trevor (Committee member) / Arizona State University (Publisher)
Created2019