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This dissertation presents methods for addressing research problems that currently can only adequately be solved using Quality Reliability Engineering (QRE) approaches especially accelerated life testing (ALT) of electronic printed wiring boards with applications to avionics circuit boards. The methods presented in this research are generally applicable to circuit boards, but the data generated and their analysis is for high performance avionics. Avionics equipment typically requires 20 years expected life by aircraft equipment manufacturers and therefore ALT is the only practical way of performing life test estimates. Both thermal and vibration ALT induced failure are performed and analyzed to resolve industry questions relating to the introduction of lead-free solder product and processes into high reliability avionics. In chapter 2, thermal ALT using an industry standard failure machine implementing Interconnect Stress Test (IST) that simulates circuit board life data is compared to real production failure data by likelihood ratio tests to arrive at a mechanical theory. This mechanical theory results in a statistically equivalent energy bound such that failure distributions below a specific energy level are considered to be from the same distribution thus allowing testers to quantify parameter setting in IST prior to life testing. In chapter 3, vibration ALT comparing tin-lead and lead-free circuit board solder designs involves the use of the likelihood ratio (LR) test to assess both complete failure data and S-N curves to present methods for analyzing data. Failure data is analyzed using Regression and two-way analysis of variance (ANOVA) and reconciled with the LR test results that indicating that a costly aging pre-process may be eliminated in certain cases. In chapter 4, vibration ALT for side-by-side tin-lead and lead-free solder black box designs are life tested. Commercial models from strain data do not exist at the low levels associated with life testing and need to be developed because testing performed and presented here indicate that both tin-lead and lead-free solders are similar. In addition, earlier failures due to vibration like connector failure modes will occur before solder interconnect failures.
ContributorsJuarez, Joseph Moses (Author) / Montgomery, Douglas C. (Thesis advisor) / Borror, Connie M. (Thesis advisor) / Gel, Esma (Committee member) / Mignolet, Marc (Committee member) / Pan, Rong (Committee member) / Arizona State University (Publisher)
Created2012
Description
Mostly, manufacturing tolerance charts are used these days for manufacturing tolerance transfer but these have the limitation of being one dimensional only. Some research has been undertaken for the three dimensional geometric tolerances but it is too theoretical and yet to be ready for operator level usage. In this research, a new three dimensional model for tolerance transfer in manufacturing process planning is presented that is user friendly in the sense that it is built upon the Coordinate Measuring Machine (CMM) readings that are readily available in any decent manufacturing facility. This model can take care of datum reference change between non orthogonal datums (squeezed datums), non-linearly oriented datums (twisted datums) etc. Graph theoretic approach based upon ACIS, C++ and MFC is laid out to facilitate its implementation for automation of the model. A totally new approach to determining dimensions and tolerances for the manufacturing process plan is also presented. Secondly, a new statistical model for the statistical tolerance analysis based upon joint probability distribution of the trivariate normal distributed variables is presented. 4-D probability Maps have been developed in which the probability value of a point in space is represented by the size of the marker and the associated color. Points inside the part map represent the pass percentage for parts manufactured. The effect of refinement with form and orientation tolerance is highlighted by calculating the change in pass percentage with the pass percentage for size tolerance only. Delaunay triangulation and ray tracing algorithms have been used to automate the process of identifying the points inside and outside the part map. Proof of concept software has been implemented to demonstrate this model and to determine pass percentages for various cases. The model is further extended to assemblies by employing convolution algorithms on two trivariate statistical distributions to arrive at the statistical distribution of the assembly. Map generated by using Minkowski Sum techniques on the individual part maps is superimposed on the probability point cloud resulting from convolution. Delaunay triangulation and ray tracing algorithms are employed to determine the assembleability percentages for the assembly.
ContributorsKhan, M Nadeem Shafi (Author) / Phelan, Patrick E (Thesis advisor) / Montgomery, Douglas C. (Committee member) / Farin, Gerald (Committee member) / Roberts, Chell (Committee member) / Henderson, Mark (Committee member) / Arizona State University (Publisher)
Created2011