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Description
This work investigates the effects of ionizing radiation and displacement damage on the retention of state, DC programming, and neuromorphic pulsed programming of Ag-Ge30Se70 conductive bridging random access memory (CBRAM) devices. The results show that CBRAM devices are susceptible to both environments. An observable degradation in electrical response due to total ionizing dose (TID) is shown during neuromorphic pulsed programming at TID below 1 Mrad using Cobalt-60. DC cycling in a 14 MeV neutron environment showed a collapse of the high resistance state (HRS) and low resistance state (LRS) programming window after a fluence of 4.9x10^{12} n/cm^2, demonstrating the CBRAM can fail in a displacement damage environment. Heavy ion exposure during retention testing and DC cycling, showed that failures to programming occurred at approximately the same threshold, indicating that the failure mechanism for the two types of tests may be the same. The dose received due to ionizing electronic interactions and non-ionizing kinetic interactions, was calculated for each ion species at the fluence of failure. TID values appear to be the most correlated, indicating that TID effects may be the dominate failure mechanism in a combined environment, though it is currently unclear as to how the displacement damage also contributes to the response. An analysis of material effects due to TID has indicated that radiation damage can limit the migration of Ag+ ions. The reduction in ion current density can explain several of the effects observed in CBRAM while in the LRS.
ContributorsTaggart, Jennifer L (Author) / Barnaby, Hugh J (Thesis advisor) / Kozicki, Michael N (Committee member) / Holbert, Keith E. (Committee member) / Yu, Shimeng (Committee member) / Arizona State University (Publisher)
Created2018
Description
The Metal Semiconductor Field Effect Transistor (MESFET) has high potential to enter analog and RF applications due to their high breakdown voltage and switching frequency characteristics. These MESFET devices could allow for high voltage analog circuits to be integrated with low voltage digital circuits on a single chip in an extremely cost effective way. Higher integration leads to electronics with increased functionality and a smaller finished product. The MESFETs are designed in-house by the research group led by Dr. Trevor Thornton. The layouts are then sent to multi-project wafer (MPW) integrated circuit foundry companies, such as the Metal Oxide Semiconductor Implementation Service (MOSIS) to be fabricated. Once returned, the electrical characteristics of the devices are measured. The MESFET has been implemented in various applications by the research group, including the low dropout linear regulator (LDO) and RF power amplifier. An advantage of the MESFET is that it can function in extreme environments such as space, allowing for complex electrical systems to continue functioning properly where traditional transistors would fail.
ContributorsKam, Jason (Author) / Thornton, Trevor (Thesis director) / Goryll, Michael (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor)
Created2015-05