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Description
From 2D planar MOSFET to 3D FinFET, the geometry of semiconductor devices is getting more and more complex. Correspondingly, the number of mesh grid points increases largely to maintain the accuracy of carrier transport and heat transfer simulations. By substituting the conventional uniform mesh with non-uniform mesh, one can reduce

From 2D planar MOSFET to 3D FinFET, the geometry of semiconductor devices is getting more and more complex. Correspondingly, the number of mesh grid points increases largely to maintain the accuracy of carrier transport and heat transfer simulations. By substituting the conventional uniform mesh with non-uniform mesh, one can reduce the number of grid points. However, the problem of how to solve governing equations on non-uniform mesh is then imposed to the numerical solver. Moreover, if a device simulator is integrated into a multi-scale simulator, the problem size will be further increased. Consequently, there exist two challenges for the current numerical solver. One is to increase the functionality to accommodate non-uniform mesh. The other is to solve governing physical equations fast and accurately on a large number of mesh grid points.

This research rst discusses a 2D planar MOSFET simulator and its numerical solver, pointing out its performance limit. By analyzing the algorithm complexity, Multigrid method is proposed to replace conventional Successive-Over-Relaxation method in a numerical solver. A variety of Multigrid methods (standard Multigrid, Algebraic Multigrid, Full Approximation Scheme, and Full Multigrid) are discussed and implemented. Their properties are examined through a set of numerical experiments. Finally, Algebraic Multigrid, Full Approximation Scheme and Full Multigrid are integrated into one advanced numerical solver based on the exact requirements of a semiconductor device simulator. A 2D MOSFET device is used to benchmark the performance, showing that the advanced Multigrid method has higher speed, accuracy and robustness.
ContributorsGuo, Xinchen (Author) / Vasileska, Dragica (Thesis advisor) / Goodnick, Stephen (Committee member) / Ferry, David (Committee member) / Arizona State University (Publisher)
Created2015
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Description
In semiconductor physics, many properties or phenomena of materials can be brought to light through certain changes in the materials. Having a tool to define new material properties so as to highlight certain phenomena greatly increases the ability to understand that phenomena. The generalized Monte Carlo tool allows the user

In semiconductor physics, many properties or phenomena of materials can be brought to light through certain changes in the materials. Having a tool to define new material properties so as to highlight certain phenomena greatly increases the ability to understand that phenomena. The generalized Monte Carlo tool allows the user to do that by keeping every parameter used to define a material, within the non-parabolic band approximation, a variable in the control of the user. A material is defined by defining its valleys, energies, valley effective masses and their directions. The types of scattering to be included can also be chosen. The non-parabolic band structure model is used. With the deployment of the generalized Monte Carlo tool onto www.nanoHUB.org the tool will be available to users around the world. This makes it a very useful educational tool that can be incorporated into curriculums. The tool is integrated with Rappture, to allow user-friendly access of the tool. The user can freely define a material in an easy systematic way without having to worry about the coding involved. The output results are automatically graphed and since the code incorporates an analytic band structure model, it is relatively fast. The versatility of the tool has been investigated and has produced results closely matching the experimental values for some common materials. The tool has been uploaded onto www.nanoHUB.org by integrating it with the Rappture interface. By using Rappture as the user interface, one can easily make changes to the current parameter sets to obtain even more accurate results.
ContributorsHathwar, Raghuraj (Author) / Vasileska, Dragica (Thesis advisor) / Goodnick, Stephen M (Committee member) / Saraniti, Marco (Committee member) / Arizona State University (Publisher)
Created2011
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Description
A dual chamber molecular beam epitaxy (MBE) system was rebuilt for the growth of 6.1 Angstrom II-VI and III-V compound semiconductor materials that are to be used in novel optoelectronic devices that take advantage of the nearly continuous bandgap availability between 0 eV and 3.4 eV. These devices include multijunction

A dual chamber molecular beam epitaxy (MBE) system was rebuilt for the growth of 6.1 Angstrom II-VI and III-V compound semiconductor materials that are to be used in novel optoelectronic devices that take advantage of the nearly continuous bandgap availability between 0 eV and 3.4 eV. These devices include multijunction solar cells and multicolor detectors. The MBE system upgrade involved the conversion of a former III-V chamber for II-VI growth. This required intensive cleaning of the chamber and components to prevent contamination. Special features including valved II-VI sources and the addition of a cold trap allowed for the full system to be baked to 200 degrees Celsius to improve vacuum conditions and reduce background impurity concentrations in epilayers. After the conversion, the system was carefully calibrated and optimized for the growth of ZnSe and ZnTe on GaAs (001) substrates. Material quality was assessed using X-ray diffraction rocking curves. ZnSe layers displayed a trend of improving quality with decreasing growth temperature reaching a minimum full-width half-maximum (FWHM) of 113 arcsec at 278 degrees Celsius. ZnTe epilayer quality increased with growth temperature under Zn rich conditions attaining a FWHM of 84 arcsec at 440 degrees Celsius. RHEED oscillations were successfully observed and used to obtain growth rate in situ for varying flux and temperature levels. For a fixed flux ratio, growth rate decreased with growth temperature as the desorption rate increased. A directly proportional dependence of growth rate on Te flux was observed for Zn rich growth. Furthermore, a method for determining the flux ratio necessary for attaining the stoichiometric condition was demonstrated.
ContributorsDettlaff, W. Hank G (Author) / Zhang, Yong-Hang (Thesis advisor) / Vasileska, Dragica (Committee member) / Johnson, Shane (Committee member) / Arizona State University (Publisher)
Created2012
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Description
This thesis mainly focuses on the study of quantum efficiency (QE) and its measurement, especially for nanowires (NWs). First, a brief introduction of nano-technology and nanowire is given to describe my initial research interest. Next various fundamental kinds of recombination mechanisms are described; both for radiative and non-radiative processes. This

This thesis mainly focuses on the study of quantum efficiency (QE) and its measurement, especially for nanowires (NWs). First, a brief introduction of nano-technology and nanowire is given to describe my initial research interest. Next various fundamental kinds of recombination mechanisms are described; both for radiative and non-radiative processes. This is an introduction for defining the internal quantum efficiency (IQE). A relative IQE measurement method is shown following that. Then it comes to the major part of the thesis discussing a procedure of quantum efficiency measurement using photoluminescence (PL) method and an integrating sphere, which has not been much applied to nanowires (NWs). In fact this is a convenient and useful approach for evaluating the quality of NWs since it considers not only the PL emission but also the absorption of NWs. The process is well illustrated and performed with both wavelength-dependent and power-dependent measurements. The measured PLQE is in the range of 0.3% ~ 5.4%. During the measurement, a phenomenon called photodegradation is observed and examined by a set of power-dependence measurements. This effect can be a factor for underestimating the PLQE and a procedure is introduced during the sample preparation process which managed to reduce this effect for some degree.
ContributorsChen, Dongzi (Author) / Ning, Cun-Zheng (Thesis advisor) / Zhang, Yong-Hang (Committee member) / Yu, Hongbin (Committee member) / Arizona State University (Publisher)
Created2012
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Description
Light Emitting Diodes even with their longer life, robust build and low power consumption, they are still plagued by some problems the most significant of which are the current droop and thermal droop. Current droop causes a lowering in the Internal Quantum Efficiency with increased current injection while thermal droo

Light Emitting Diodes even with their longer life, robust build and low power consumption, they are still plagued by some problems the most significant of which are the current droop and thermal droop. Current droop causes a lowering in the Internal Quantum Efficiency with increased current injection while thermal droop lowers the whole Internal Quantum Efficiency curve with increase in temperature. The focus here was understanding effects of thermal droop and develop a method to control it.

Shockley Read Hall recombination plays a dominant role in the thermal droop effect when the current injection is low. Since the blue light emitting diode is based on Gallium Nitride, we need to take into consideration the effect of piezoelectric polarization in the quantum wells. The effects of the piezoelectric fields were studied based on the Gallium Nitride plane orientations. It was found in a Gallium Nitride light emitting diodes simulation study that more the number of quantum wells, lower would be the Radiative recombination rate. The problem of exacerbated spatial separation of electron hole wavefunctions in a thick single quantum well structure lead to the development of a dual well structure where one well assisted the other during high temperature operations. The Electron Blocking Layer was reduced in thickness and was made only 10 nm thick with a 5 nm Gallium Nitride buffer between it and the active region wells. The main reason for reducing the electron blocking layer thickness was to reduce the valance band offset and improve hole transport into the active region. Three different dual well designs were simulated of 3nm, 6nm and 9nm wide wells. The output parameters like the Power Spectral Density, Electron bound density, Light Output Power and Electron-Hole wavefunction overlaps were calculated. It was found that one of the wells acted as an assisting well where it had very little radiative recombination activity in it at room temperature.

As the temperature increased, it was observed that the electrons in the main well started to overflow out of it and into the assisting well where the radiative recombination rate increased significantly. This lead to a boost in Internal Quantum Efficiency.
ContributorsDas, Shiladitya (Author) / Zhao, Yuji (Thesis advisor) / Vasileska, Dragica (Committee member) / Ning, Cun-Zheng (Committee member) / Arizona State University (Publisher)
Created2017