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Description
Wide bandgap (WBG) semiconductors GaN (3.4 eV), Ga2O3 (4.8 eV) and AlN (6.2 eV), have gained considerable interests for energy-efficient optoelectronic and electronic applications in solid-state lighting, photovoltaics, power conversion, and so on. They can offer unique device performance compared with traditional semiconductors such as Si. Efficient GaN based light-emitting

Wide bandgap (WBG) semiconductors GaN (3.4 eV), Ga2O3 (4.8 eV) and AlN (6.2 eV), have gained considerable interests for energy-efficient optoelectronic and electronic applications in solid-state lighting, photovoltaics, power conversion, and so on. They can offer unique device performance compared with traditional semiconductors such as Si. Efficient GaN based light-emitting diodes (LEDs) have increasingly displaced incandescent and fluorescent bulbs as the new major light sources for lighting and display. In addition, due to their large bandgap and high critical electrical field, WBG semiconductors are also ideal candidates for efficient power conversion.

In this dissertation, two types of devices are demonstrated: optoelectronic and electronic devices. Commercial polar c-plane LEDs suffer from reduced efficiency with increasing current densities, knowns as “efficiency droop”, while nonpolar/semipolar LEDs exhibit a very low efficiency droop. A modified ABC model with weak phase space filling effects is proposed to explain the low droop performance, providing insights for designing droop-free LEDs. The other emerging optoelectronics is nonpolar/semipolar III-nitride intersubband transition (ISBT) based photodetectors in terahertz and far infrared regime due to the large optical phonon energy and band offset, and the potential of room-temperature operation. ISBT properties are systematically studied for devices with different structures parameters.

In terms of electronic devices, vertical GaN p-n diodes and Schottky barrier diodes (SBDs) with high breakdown voltages are homoepitaxially grown on GaN bulk substrates with much reduced defect densities and improved device performance. The advantages of the vertical structure over the lateral structure are multifold: smaller chip area, larger current, less sensitivity to surface states, better scalability, and smaller current dispersion. Three methods are proposed to boost the device performances: thick buffer layer design, hydrogen-plasma based edge termination technique, and multiple drift layer design. In addition, newly emerged Ga2O3 and AlN power electronics may outperform GaN devices. Because of the highly anisotropic crystal structure of Ga2O3, anisotropic electrical properties have been observed in Ga2O3 electronics. The first 1-kV-class AlN SBDs are demonstrated on cost-effective sapphire substrates. Several future topics are also proposed including selective-area doping in GaN power devices, vertical AlN power devices, and (Al,Ga,In)2O3 materials and devices.
ContributorsFu, Houqiang (Author) / Zhao, Yuji (Thesis advisor) / Vasileska, Dragica (Committee member) / Goodnick, Stephen (Committee member) / Yu, Hongbin (Committee member) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2019
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Description
The primary goal of this thesis is to evaluate the influence of ethyl vinyl acetate (EVA) and polyolefin elastomer (POE) encapsulant types on the glass-glass (GG) photovoltaic (PV) module reliability. The influence of these two encapsulant types on the reliability of GG modules was compared with baseline glass-polymer backsheet (GB)

The primary goal of this thesis is to evaluate the influence of ethyl vinyl acetate (EVA) and polyolefin elastomer (POE) encapsulant types on the glass-glass (GG) photovoltaic (PV) module reliability. The influence of these two encapsulant types on the reliability of GG modules was compared with baseline glass-polymer backsheet (GB) modules for a benchmarking purpose. Three sets of modules, with four modules in each set, were constructed with two substrates types i.e. glass-glass (GG) and glass- polymer backsheet (GB); and 2 encapsulants types i.e. ethyl vinyl acetate (EVA) and polyolefin elastomer (POE). Each module set was subjected to the following accelerated tests as specified in the International Electrotechnical Commission (IEC) standard and Qualification Plus protocol of NREL: Ultraviolet (UV) 250 kWh/m2; Thermal Cycling (TC) 200 cycles; Damp Heat (DH) 1250 hours. To identify the failure modes and reliability issues of the stressed modules, several module-level non-destructive characterizations were carried out and they include colorimetry, UV-Vis-NIR spectral reflectance, ultraviolet fluorescence (UVF) imaging, electroluminescence (EL) imaging, and infrared (IR) imaging. The above-mentioned characterizations were performed on the front side of the modules both before the stress tests (i.e. pre-stress) and after the stress tests (i.e. post-stress). The UV-250 extended stress results indicated slight changes in the reflectance on the non-cell area of EVA modules probably due to minor adhesion loss at the cell and module edges. From the DH-1250 extended stress tests, significant changes, in both encapsulant types modules, were observed in reflectance and UVF images indicating early stages of delamination. In the case of the TC-200 stress test, practically no changes were observed in all sets of modules. From the above short-term stress tests, it appears although not conclusive at this stage of the analysis, delamination seems to be the only failure mode that could possibly be affecting the module performance, as observed from UV and DH extended stress tests. All these stress tests need to be continued to identify the wear-out failure modes and their impacts on the performance parameters of PV modules.
ContributorsBhaskaran, Rahul (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Phelan, Patrick (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2020
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Description
Photonic integrated circuit (PIC) in the visible spectrum opens up new opportunities for frequency metrology, neurophotonics, and quantum technologies. Group III nitride (III-N) compound semiconductor is a new emerging material platform for PIC in visible spectrum. The ultra-wide bandgap of aluminum nitride (AlN) allows broadband transparency. The high quantum efficiency

Photonic integrated circuit (PIC) in the visible spectrum opens up new opportunities for frequency metrology, neurophotonics, and quantum technologies. Group III nitride (III-N) compound semiconductor is a new emerging material platform for PIC in visible spectrum. The ultra-wide bandgap of aluminum nitride (AlN) allows broadband transparency. The high quantum efficiency of indium gallium nitride (InGaN) quantum well is the major enabler for solid-state lighting and provides the opportunities for active photonic integration. Additionally, the two-dimensional electron gas induced by spontaneous and polarization charges within III-N materials exhibit large electron mobility, which is promising for the development of high frequency transistors. Moreover, the noncentrosymmetric crystalline structure gives nonzero second order susceptibility, beneficial for the application of second harmonic generation and entangled photon generation in nonlinear and quantum optical technologies. Despite the promising features of III-N materials, the investigations on the III-N based PICs are still primitive, mainly due to the difficulties in material growth and the lack of knowledge on fundamental material parameters. In this work, firstly, the fundamental nonlinear optical properties of III-N materials will be characterized. Then, the fabrication process flow of III-N materials will be established. Thirdly, the waveguide performance will be theoretically and experimentally evaluated. At last, the supercontinuum generation from visible to infrared will be demonstrated by utilizing soliton dynamics in high order guided modes. The outcome from this work paves the way towards fully integrated optical comb in UV and visible spectrum.
ContributorsChen, Hong (Author) / Zhao, Yuji (Thesis advisor) / Yao, Yu (Committee member) / Wang, Liping (Committee member) / Ning, Cun-Zheng (Committee member) / Arizona State University (Publisher)
Created2020