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Solar photovoltaic (PV) generation has seen significant growth in 2021, with an increase of around 22% and exceeding 1000 TWh. However, this has also led to reliability and durability issues, particularly potential induced degradation (PID), which can reduce module output by up to 30%. This study uses cell- and module-level

Solar photovoltaic (PV) generation has seen significant growth in 2021, with an increase of around 22% and exceeding 1000 TWh. However, this has also led to reliability and durability issues, particularly potential induced degradation (PID), which can reduce module output by up to 30%. This study uses cell- and module-level analysis to investigate the impact of superstrate, encapsulant, and substrate on PID.The influence of different substrates and encapsulants is studied using one-cell modules, showing that substrates with poor water-blocking properties can worsen PID, and encapsulants with lower volumetric resistance can conduct easily under damp conditions, enabling PID mechanisms (results show maximum degradation of 9%). Applying an anti-soiling coating on the front glass (superstrate) reduces PID by nearly 53%. Typical superstrates have sodium which accelerates the PID process, and therefore, using such coatings can lessen the PID problem. At the module level, the study examines the influence of weakened interface adhesion strengths in traditional Glass-Backsheet (GB) and emerging Glass-Glass (GG) (primarily bifacial modules) constructions. The findings show nearly 64% more power degradation in GG modules than in GB. Moreover, the current methods for detecting PID use new modules, which can give inaccurate information instead of DH-stressed modules for PID testing, as done in this work. A comprehensive PID susceptibility analysis for multiple fresh bifacial constructions shows significant degradation from 20 to 50% in various constructions. The presence of glass as the substrate exacerbates the PID problem due to more ionic activity available from the two glass sides. Recovery experiments are also conducted to understand the extent of the PID issue. Overall, this study identifies, studies, and explains the impact of superstrate, substrate, and encapsulant on the underlying PID mechanisms. Various pre- and post-stress characterization tests, including light and dark current-voltage (I-V) tests, electroluminescence (EL) imaging, infrared (IR) imaging, and UV fluorescence (UVF) imaging, are used to evaluate the findings. This study is significant as it provides insights into the PID issues in solar PV systems, which can help improve their performance and reliability.
ContributorsMahmood, Farrukh ibne (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Oh, Jaewon (Committee member) / Rajadas, John (Committee member) / Arizona State University (Publisher)
Created2023
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Description
The popularity of solar photovoltaic (PV) energy is growing across the globe with more than 500 GW installed in 2018 with a capacity of 640 GW in 2019. Improved PV module reliability minimizes the levelized cost of energy. Studying and accelerating encapsulant browning and solder bond degradation—two of the most

The popularity of solar photovoltaic (PV) energy is growing across the globe with more than 500 GW installed in 2018 with a capacity of 640 GW in 2019. Improved PV module reliability minimizes the levelized cost of energy. Studying and accelerating encapsulant browning and solder bond degradation—two of the most commonly observed degradation modes in the field—in a lab requires replicating the stress conditions that induce the same field degradation modes in a controlled accelerated environment to reduce testing time.

Accelerated testing is vital in learning about the reliability of solar PV modules. The unique streamlined approach taken saves time and resources with a statistically significant number of samples being tested in one chamber under multiple experimental stress conditions that closely mirror field conditions that induce encapsulant browning and solder bond degradation. With short circuit current (Isc) and series resistance (Rs) degradation data sets at multiple temperatures, the activation energies (Ea) for encapsulant browning and solder bond degradation was calculated.

Regular degradation was replaced by the wear-out stages of encapsulant browning and solder bond degradation by subjecting two types of field-aged modules to further accelerated testing. For browning, the Ea calculated through the Arrhenius model was 0.37 ± 0.17 eV and 0.71 ± 0.07 eV. For solder bond degradation, the Arrhenius model was used to calculate an Ea of 0.12 ± 0.05 eV for solder with 2wt% Ag and 0.35 ± 0.04 eV for Sn60Pb40 solder.

To study the effect of types of encapsulant, backsheet, and solder on encapsulant browning and solder bond degradation, 9-cut-cell samples maximizing available data points while minimizing resources underwent accelerated tests described for modules. A ring-like browning feature was observed in samples with UV pass EVA above and UV cut EVA below the cells. The backsheet permeability influences the extent of oxygen photo-bleaching. In samples with solder bond degradation, increased bright spots and cell darkening resulted in increased Rs. Combining image processing with fluorescence imaging and electroluminescence imaging would yield great insight into the two degradation modes.
ContributorsGopalakrishna, Hamsini (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Hacke, Peter (Committee member) / Arizona State University (Publisher)
Created2020