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Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current

Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current density is of great concern affecting the reliability of the entire microelectronics systems. This paper reviews electromigration in Pb- free solders, focusing specifically on Sn0.7wt.% Cu solder joints. Effect of texture, grain orientation, and grain-boundary misorientation angle on electromigration and intermetallic compound (IMC) formation is studied through EBSD analysis performed on actual C4 bumps.
ContributorsLara, Leticia (Author) / Tasooji, Amaneh (Thesis advisor) / Lee, Kyuoh (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2013
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Description
III-Nitride nanostructures have been an active area of research recently due to their ability to tune their optoelectronic properties. Thus far work has been done on InGaN quantum dots, nanowires, nanopillars, amongst other structures, but this research reports the creation of a new type of InGaN nanostructure, nanorings. Hexagonal InGaN

III-Nitride nanostructures have been an active area of research recently due to their ability to tune their optoelectronic properties. Thus far work has been done on InGaN quantum dots, nanowires, nanopillars, amongst other structures, but this research reports the creation of a new type of InGaN nanostructure, nanorings. Hexagonal InGaN nanorings were formed using Metal Organic Chemical Vapor Deposition through droplet epitaxy. The nanorings were thoroughly analyzed using x-ray diffraction, photoluminescence, electron microscopy, electron diffraction, and atomic force microscopy. Nanorings with high indium incorporation were achieved with indium content up to 50% that was then controlled using the growth time, temperature, In/Ga ratio and III/N ratio. The analysis showed that the nanoring shape is able to incorporate more indium than other nanostructures, due to the relaxing mechanism involved in the formation of the nanoring. The ideal conditions were determined to be growth of 30 second droplets with a growth time of 1 minute 30 seconds at 770 C to achieve the most well developed rings with the highest indium concentration.
ContributorsZaidi, Zohair (Author) / Mahajan, Subhash (Thesis advisor) / O'Connell, Michael J (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
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Description
Zinc oxide (ZnO) has attracted much interest during last decades as a functional material. Furthermore, ZnO is a potential material for transparent conducting oxide material competing with indium tin oxide (ITO), graphene, and carbon nanotube film. It has been known as a conductive material when doped with elements such as

Zinc oxide (ZnO) has attracted much interest during last decades as a functional material. Furthermore, ZnO is a potential material for transparent conducting oxide material competing with indium tin oxide (ITO), graphene, and carbon nanotube film. It has been known as a conductive material when doped with elements such as indium, gallium and aluminum. The solubility of those dopant elements in ZnO is still debatable; but, it is necessary to find alternative conducting materials when their form is film or nanostructure for display devices. This is a consequence of the ever increasing price of indium. In addition, a new generation solar cell (nanostructured or hybrid photovoltaics) requires compatible materials which are capable of free standing on substrates without seed or buffer layers and have the ability introduce electrons or holes pathway without blocking towards electrodes. The nanostructures for solar cells using inorganic materials such as silicon (Si), titanium oxide (TiO2), and ZnO have been an interesting topic for research in solar cell community in order to overcome the limitation of efficiency for organic solar cells. This dissertation is a study of the rational solution-based synthesis of 1-dimentional ZnO nanomaterial and its solar cell applications. These results have implications in cost effective and uniform nanomanufacturing for the next generation solar cells application by controlling growth condition and by doping transition metal element in solution.
ContributorsChoi, Hyung Woo (Author) / Alford, Terry L. (Thesis advisor) / Krause, Stephen (Committee member) / Theodore, N. David (Committee member) / Arizona State University (Publisher)
Created2012
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Description
Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder material,

Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder material, manufacturing process, use condition, as well as, the inherent variabilities present in the system, greatly influence product reliability. Accurate reliability analysis requires an integrated approach to concurrently account for all these factors and their synergistic effects. Such an integrated and robust methodology can be used in design and development of new and advanced microelectronics systems and can provide significant improvement in cycle-time, cost, and reliability. IMPRPK approach is based on a probabilistic methodology, focusing on three major tasks of (1) Characterization of BGA solder joints to identify failure mechanisms and obtain statistical data, (2) Finite Element analysis (FEM) to predict system response needed for life prediction, and (3) development of a probabilistic methodology to predict the reliability, as well as, the sensitivity of the system to various parameters and the variabilities. These tasks and the predictive capabilities of IMPRPK in microelectronic reliability analysis are discussed.
ContributorsFallah-Adl, Ali (Author) / Tasooji, Amaneh (Thesis advisor) / Krause, Stephen (Committee member) / Alford, Terry (Committee member) / Jiang, Hanqing (Committee member) / Mahajan, Ravi (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Electromigration in metal interconnects is the most pernicious failure mechanism in semiconductor integrated circuits (ICs). Early electromigration investigations were primarily focused on aluminum interconnects for silicon-based ICs. An alternative metallization compatible with gallium arsenide (GaAs) was required in the development of high-powered radio frequency (RF) compound semiconductor devices operating at

Electromigration in metal interconnects is the most pernicious failure mechanism in semiconductor integrated circuits (ICs). Early electromigration investigations were primarily focused on aluminum interconnects for silicon-based ICs. An alternative metallization compatible with gallium arsenide (GaAs) was required in the development of high-powered radio frequency (RF) compound semiconductor devices operating at higher current densities and elevated temperatures. Gold-based metallization was implemented on GaAs devices because it uniquely forms a very low resistance ohmic contact and gold interconnects have superior electrical and thermal conductivity properties. Gold (Au) was also believed to have improved resistance to electromigration due to its higher melting temperature, yet electromigration reliability data on passivated Au interconnects is scarce and inadequate in the literature. Therefore, the objective of this research was to characterize the electromigration lifetimes of passivated Au interconnects under precisely controlled stress conditions with statistically relevant quantities to obtain accurate model parameters essential for extrapolation to normal operational conditions. This research objective was accomplished through measurement of electromigration lifetimes of large quantities of passivated electroplated Au interconnects utilizing high-resolution in-situ resistance monitoring equipment. Application of moderate accelerated stress conditions with a current density limited to 2 MA/cm2 and oven temperatures in the range of 300°C to 375°C avoided electrical overstress and severe Joule-heated temperature gradients. Temperature coefficients of resistance (TCRs) were measured to determine accurate Joule-heated Au interconnect film temperatures. A failure criterion of 50% resistance degradation was selected to prevent thermal runaway and catastrophic metal ruptures that are problematic of open circuit failure tests. Test structure design was optimized to reduce resistance variation and facilitate failure analysis. Characterization of the Au microstructure yielded a median grain size of 0.91 ìm. All Au lifetime distributions followed log-normal distributions and Black's model was found to be applicable. An activation energy of 0.80 ± 0.05 eV was measured from constant current electromigration tests at multiple temperatures. A current density exponent of 1.91 was extracted from multiple current densities at a constant temperature. Electromigration-induced void morphology along with these model parameters indicated grain boundary diffusion is dominant and the void nucleation mechanism controlled the failure time.
ContributorsKilgore, Stephen (Author) / Adams, James (Thesis advisor) / Schroder, Dieter (Thesis advisor) / Krause, Stephen (Committee member) / Gaw, Craig (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Students may use the technical engineering terms without knowing what these words mean. This creates a language barrier in engineering that influences student learning. Previous research has been conducted to characterize the difference between colloquial and scientific language. Since this research had not yet been applied explicitly to engineering, conclusions

Students may use the technical engineering terms without knowing what these words mean. This creates a language barrier in engineering that influences student learning. Previous research has been conducted to characterize the difference between colloquial and scientific language. Since this research had not yet been applied explicitly to engineering, conclusions from the area of science education were used instead. Various researchers outlined strategies for helping students acquire scientific language. However, few examined and quantified the relationship it had on student learning. A systemic functional linguistics framework was adopted for this dissertation which is a framework that has not previously been used in engineering education research. This study investigated how engineering language proficiency influenced conceptual understanding of introductory materials science and engineering concepts. To answer the research questions about engineering language proficiency, a convenience sample of forty-one undergraduate students in an introductory materials science and engineering course was used. All data collected was integrated with the course. Measures included the Materials Concept Inventory, a written engineering design task, and group observations. Both systemic functional linguistics and mental models frameworks were utilized to interpret data and guide analysis. A series of regression analyses were conducted to determine if engineering language proficiency predicts group engineering term use, if conceptual understanding predicts group engineering term use, and if conceptual understanding predicts engineering language proficiency. Engineering academic language proficiency was found to be strongly linked to conceptual understanding in the context of introductory materials engineering courses. As the semester progressed, this relationship became even stronger. The more engineering concepts students are expected to learn, the more important it is that they are proficient in engineering language. However, exposure to engineering terms did not influence engineering language proficiency. These results stress the importance of engineering language proficiency for learning, but warn that simply exposing students to engineering terms does not promote engineering language proficiency.
ContributorsKelly, Jacquelyn (Author) / Baker, Dale (Thesis advisor) / Ganesh, Tirupalavanam G. (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
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Description
This report will review the mechanical and microstructural properties of the refractory element rhenium (Re) deposited using Laser Additive Manufacturing (LAM). With useable structural strength over 2200 °C, existing applications up to 2760 °C, very high strength, ductility and chemical resistance, interest in Re is understandable. This study includes data

This report will review the mechanical and microstructural properties of the refractory element rhenium (Re) deposited using Laser Additive Manufacturing (LAM). With useable structural strength over 2200 °C, existing applications up to 2760 °C, very high strength, ductility and chemical resistance, interest in Re is understandable. This study includes data about tensile properties including tensile data up to 1925 °C, fracture modes, fatigue and microstructure including deformation systems and potential applications of that information. The bulk mechanical test data will be correlated with nanoindentation and crystallographic examination. LAM properties are compared to the existing properties found in the literature for other manufacturing processes. The literature indicates that Re has three significant slip systems but also twins as part of its deformation mechanisms. While it follows the hcp metal characteristics for deformation, it has interesting and valuable extremes such as high work hardening, potentially high strength, excellent wear resistance and superior elevated temperature strength. These characteristics are discussed in detail.
ContributorsAdams, Robbie (Author) / Chawla, Nikhilesh (Thesis advisor) / Adams, James (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
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Description
To supplement lectures, various resources are available to students; however, little research has been done to look systematically at which resources studies find most useful and the frequency at which they are used. We have conducted a preliminary study looking at various resources available in an introductory material science course

To supplement lectures, various resources are available to students; however, little research has been done to look systematically at which resources studies find most useful and the frequency at which they are used. We have conducted a preliminary study looking at various resources available in an introductory material science course over four semesters using a custom survey called the Student Resource Value Survey (SRVS). More specifically, the SRVS was administered before each test to determine which resources students use to do well on exams. Additionally, over the course of the semester, which resources students used changed. For instance, study resources for exams including the use of homework problems decreased from 81% to 50%, the utilization of teaching assistant for exam studying increased from 25% to 80%, the use of in class Muddiest Points for exam study increased form 28% to 70%, old exams and quizzes only slightly increased for exam study ranging from 78% to 87%, and the use of drop-in tutoring services provided to students at no charge decreased from 25% to 17%. The data suggest that students thought highly of peer interactions by using those resources more than tutoring centers. To date, no research has been completed looking at courses at the department level or a different discipline. To this end, we adapted the SRVS administered in material science to investigate resource use in thirteen biomedical engineering (BME) courses. Here, we assess the following research question: "From a variety of resources, which do biomedical engineering students feel addresses difficult concept areas, prepares them for examinations, and helps in computer-aided design (CAD) and programming the most and with what frequency?" The resources considered include teaching assistants, classroom notes, prior exams, homework problems, Muddiest Points, office hours, tutoring centers, group study, and the course textbook. Results varied across the four topical areas: exam study, difficult concept areas, CAD software, and math-based programming. When preparing for exams and struggling with a learning concept, the most used and useful resources were: 1) homework problems, 2) class notes and 3) group studying. When working on math-based programming (Matlab and Mathcad) as well as computer-aided design, the most used and useful resources were: 1) group studying, 2) engineering tutoring center, and 3) undergraduate teaching assistants. Concerning learning concepts and exams in the BME department, homework problems and class notes were considered some of the highest-ranking resources for both frequency and usefulness. When comparing to the pilot study in MSE, both BME and MSE students tend to highly favor peer mentors and old exams as a means of studying for exams at the end of the semester1. Because the MSE course only considered exams, we cannot make any comparisons to BME data concerning programming and CAD. This analysis has highlighted potential resources that are universally beneficial, such as the use of peer work, i.e. group studying, engineering tutoring center, and teaching assistants; however, we see differences by both discipline and topical area thereby highlighting the need to determine important resources on a class-by-class basis as well.
ContributorsMalkoc, Aldin (Author) / Ankeny, Casey (Thesis director) / Krause, Stephen (Committee member) / Harrington Bioengineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
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Description
The focus of education in the classroom traditionally is one of fact memorization and recall. The teaching process of linear knowledge progression is not always in tune with the way that the human brain actually processes, conceptualizes, and comprehends concepts and information. In an introductory engineering class, focused on materials

The focus of education in the classroom traditionally is one of fact memorization and recall. The teaching process of linear knowledge progression is not always in tune with the way that the human brain actually processes, conceptualizes, and comprehends concepts and information. In an introductory engineering class, focused on materials engineering and its related concepts, a system of lecture interventions has been put in place to increase concept comprehension by supplementing lecture units with various activities, from additional worksheets, explicit concept discussions, and most recently, YouTube videos showcasing specific concepts and situations. In an attempt to correct the lack of actual concept comprehension, these interventions seek to interact with the human mind in a way that capitalizes on its ability to process and interpret non-linear knowledge and information.

Using a concept test given prior to the lecture unit, and after, the difference in scores is used to recognize if the concepts presented have actually been comprehended. Used specifically in a lecture unit on solubility and solutions, the concept test tested student’s knowledge of supersaturated, saturated, and unsaturated solutions. With a visual identification and a written explanation, the student’s ability to identify and explain the three solutions was tested.

In order to determine the cause of the change in score from pre- to post-test, an analysis of the change in scores and the effects of question type and solution type was conducted. The significant results are as follows:
 The change in score from pre- to post-test was found to be significant, with the only difference between the two tests being the lecture unit and intervention
 From pre- to post-test, solution type had a significant effect on the score, with the unsaturated solution being the most easily recognized and explained solution type
 Students that felt that the YouTube videos greatly increased their concept comprehension, on average, performed better than their counterparts and also saw a greater increase their score from pre- to post-test
ContributorsLinich, Christopher Graham (Author) / Krause, Stephen (Thesis director) / Middleton, James (Committee member) / Barrett, The Honors College (Contributor) / Mechanical and Aerospace Engineering Program (Contributor)
Created2014-05