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The flow of liquid PDMS (10:1 v/v base to cross-linker ratio) in open, rectangular silicon micro channels, with and without a hexa-methyl-di-silazane (HMDS) or poly-tetra-fluoro-ethylene (PTFE) (120 nm) coat, was studied. Photolithographic patterning and etching of silicon wafers was used to create micro channels with a range of widths (5-50

The flow of liquid PDMS (10:1 v/v base to cross-linker ratio) in open, rectangular silicon micro channels, with and without a hexa-methyl-di-silazane (HMDS) or poly-tetra-fluoro-ethylene (PTFE) (120 nm) coat, was studied. Photolithographic patterning and etching of silicon wafers was used to create micro channels with a range of widths (5-50 μm) and depths (5-20 μm). The experimental PDMS flow rates were compared to an analytical model based on the work of Lucas and Washburn. The experimental flow rates closely matched the predicted flow rates for channels with an aspect ratio (width to depth), p, between one and two. Flow rates in channels with p less than one were higher than predicted whereas the opposite was true for channels with p greater than two. The divergence between the experimental and predicted flow rates steadily increased with increasing p. These findings are rationalized in terms of the effect of channel dimensions on the front and top meniscus morphology and the possible deviation from the no-slip condition at the channel walls at high shear rates.

In addition, a preliminary experimental setup for calibration tests on ultrasensitive PDMS cantilever beams is reported. One loading and unloading cycle is completed on a microcantilever PDMS beam (theoretical stiffness 0.5 pN/ µm). Beam deflections are actuated by adjusting the buoyancy force on the beam, which is submerged in water, by the addition of heat. The expected loading and unloading curve is produced, albeit with significant noise. The experimental results indicate that the beam stiffness is a factor of six larger than predicted theoretically. One probable explanation is that the beam geometry may change when it is removed from the channel after curing, making assumptions about the beam geometry used in the theoretical analysis inaccurate. This theory is bolstered by experimental data discussed in the report. Other sources of error which could partially contribute to the divergent results are discussed. Improvements to the experimental setup for future work are suggested.
ContributorsSowers, Timothy Wayne (Author) / Rajagopalan, Jagannathan (Thesis advisor) / Herrmann, Marcus (Committee member) / Huang, Huei-Ping (Committee member) / Arizona State University (Publisher)
Created2014
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Description
The stability of nanocrystalline microstructural features allows structural materials to be synthesized and tested in ways that have heretofore been pursued only on a limited basis, especially under dynamic loading combined with temperature effects. Thus, a recently developed, stable nanocrystalline alloy is analyzed here for quasi-static (<100 s-1) and dynamic

The stability of nanocrystalline microstructural features allows structural materials to be synthesized and tested in ways that have heretofore been pursued only on a limited basis, especially under dynamic loading combined with temperature effects. Thus, a recently developed, stable nanocrystalline alloy is analyzed here for quasi-static (<100 s-1) and dynamic loading (103 to 104 s-1) under uniaxial compression and tension at multiple temperatures ranging from 298-1073 K. After mechanical tests, microstructures are analyzed and possible deformation mechanisms are proposed. Following this, strain and strain rate history effects on mechanical behavior are analyzed using a combination of quasi-static and dynamic strain rate Bauschinger testing. The stable nanocrystalline material is found to exhibit limited flow stress increase with increasing strain rate as compared to that of both pure, coarse grained and nanocrystalline Cu. Further, the material microstructural features, which includes Ta nano-dispersions, is seen to pin dislocation at quasi-static strain rates, but the deformation becomes dominated by twin nucleation at high strain rates. These twins are pinned from further growth past nucleation by the Ta nano-dispersions. Testing of thermal and load history effects on the mechanical behavior reveals that when thermal energy is increased beyond 200 °C, an upturn in flow stress is present at strain rates below 104 s-1. However, in this study, this simple assumption, established 50-years ago, is shown to break-down when the average grain size and microstructural length-scale is decreased and stabilized below 100nm. This divergent strain-rate behavior is attributed to a unique microstructure that alters slip-processes and their interactions with phonons; thus enabling materials response with a constant flow-stress even at extreme conditions. Hence, the present study provides a pathway for designing and synthesizing a new-level of tough and high-energy absorbing materials.
ContributorsTurnage, Scott Andrew (Author) / Solanki, Kiran N (Thesis advisor) / Rajagopalan, Jagannathan (Committee member) / Peralta, Pedro (Committee member) / Darling, Kristopher A (Committee member) / Mignolet, Marc (Committee member) / Arizona State University (Publisher)
Created2017
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Description
Mechanical behavior of metallic thin films at room temperature (RT) is relatively well characterized. However, measuring the high temperature mechanical properties of thin films poses several challenges. These include ensuring uniformity in sample temperature and minimizing temporal fluctuations due to ambient heat loss, in addition to difficulties involved in mechanical

Mechanical behavior of metallic thin films at room temperature (RT) is relatively well characterized. However, measuring the high temperature mechanical properties of thin films poses several challenges. These include ensuring uniformity in sample temperature and minimizing temporal fluctuations due to ambient heat loss, in addition to difficulties involved in mechanical testing of microscale samples. To address these issues, we designed and analyzed a MEMS-based high temperature tensile testing stage made from single crystal silicon. The freestanding thin film specimens were co-fabricated with the stage to ensure uniaxial loading. Multi-physics simulations of Joule heating, incorporating both radiation and convection heat transfer, were carried out using COMSOL to map the temperature distribution across the stage and the specimen. The simulations were validated using temperature measurements from a thermoreflectance microscope.
ContributorsEswarappa Prameela, Suhas (Author) / Rajagopalan, Jagannathan (Thesis advisor) / Wang, Liping (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2016