Matching Items (1)

Filtering by

Clear all filters

158707-Thumbnail Image.png

Insights into Crack Dynamics Governing Surface Quality during Spalling of Semiconductors

Description

The rationale of this thesis is to provide a thorough understanding of spalling for semiconductor materials and develop a low temperature spalling technology that reduces the surface roughness of the spalled wafers for Photovoltaics applications.

Contributors

Agent

Created

Date Created
  • 2020