Insights into Crack Dynamics Governing Surface Quality during Spalling of Semiconductors
Description
The rationale of this thesis is to provide a thorough understanding of spalling for semiconductor materials and develop a low temperature spalling technology that reduces the surface roughness of the spalled wafers for Photovoltaics applications.
Agent
- Guimera Coll, Pablo (Author)
- Bertoni, Mariana I (Thesis advisor)
- Meier, Rico (Committee member)
- Holman, Zachary (Committee member)
- Wang, Qing Hua (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2020