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201891 https://hdl.handle.net/2286/R.2.N.201891 http://rightsstatements.org/vocab/InC/1.0/ All Rights Reserved 2025 65 pages Masters Thesis Academic theses en Bala Babu, Bhargav Alford, Terry L Li, Cindy (Xiangjia) Nian, Qiong (Eric) Arizona State University Partial requirement for: M.S., Arizona State University, 2025 Field of study: Mechanical Engineering The integration of diamond into semiconductor technology offers significant advantages due to its high thermal conductivity, wide bandgap, and exceptional carrier mobility. These properties make diamond a promising candidate for thermal management and high-power electronic applications. This work involved a structural assessment of diamond-coated silicon thin wafers using high-resolution X-ray diffraction. Rocking curve measurements were used to obtain full-width at half-maximum (FWHM) values, providing insights into the crystalline quality of the deposited layers. Additionally, azimuthal omega scans were performed to determine the miscut angle of the wafers through sinusoidal fitting. The analysis revealed moderate crystalline alignment, with the rear surface showing narrower peak widths and higher intensities compared to the front, indicating improved local crystalline order. These findings demonstrate a nondestructive and reproducible methodology for evaluating wafer orientation and crystalline quality, supporting efforts to enhance diamond wafer integration in semiconductor packaging. Engineering Mechanical Engineering Materials Science Crystalline Alignment Diamond thin films High-Resolution X-ray Diffraction (HR-XRD) Miscut Angle Measurement Semiconductor Packaging Wafer Bonding Analysis of the Deposited Diamond Layers on Thin Films