Description
Special thermal interface materials are required for connecting devices that operate at high temperatures up to 300°C. Because devices used in power electronics, such as GaN, SiC, and other wide bandgap semiconductors, can reach very high temperatures (beyond 250°C), a high melting point, and high thermal & electrical conductivity are required for the thermal interface material.
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Details
Contributors
- Amla, Tarun (Author)
- Chawla, Nikhilesh (Thesis advisor)
- Jiao, Yang (Committee member)
- Liu, Yongming (Committee member)
- Zhuang, Houlong (Committee member)
- Jiang, Hanqing (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2020
Resource Type
Collections this item is in
Note
- Partial requirement for: Ph.D., Arizona State University, 2020
- Field of study: Mechanical Engineering