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Combining the rapid development of semiconductor technologies, miniaturization of integrated circuits (ICs), and scaling down the device size is trending towards faster, cheaper, and more reliable components for low-power integrated

Combining the rapid development of semiconductor technologies, miniaturization of integrated circuits (ICs), and scaling down the device size is trending towards faster, cheaper, and more reliable components for low-power integrated circuits. Most research and development relate to efficiency, structure, materials, and performance. However, the thermal problem is also created and becomes more critical with shrinking device dimensions and increased integration densities, such that it affects the device performance and leads to degradation and damage.

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Date Created
  • 2020
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  • Text
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    • Doctoral Dissertation Electrical Engineering 2020

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