Description
The rationale of this thesis is to provide a thorough understanding of spalling for semiconductor materials and develop a low temperature spalling technology that reduces the surface roughness of the spalled wafers for Photovoltaics applications.
Copyright Statement
Details
Title
- Insights into Crack Dynamics Governing Surface Quality during Spalling of Semiconductors
Contributors
- Guimera Coll, Pablo (Author)
- Bertoni, Mariana I (Thesis advisor)
- Meier, Rico (Committee member)
- Holman, Zachary (Committee member)
- Wang, Qing Hua (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2020
Resource Type
Collections this item is in
Note
- Doctoral Dissertation Materials Science and Engineering 2020