As the microelectronics industry continues to decrease the size of solder joints, each joint will have to carry a greater current density, making atom diffusion due to current flow, electromigration (EM), a problem of ever-increasing severity. The rate of EM damage depends on current density, operating temperature, and the original microstructure of the solder joint, including void volume, grain orientation, and grain size.
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- Partial requirement for: Ph.D., Arizona State University, 2019Note typethesis
- Includes bibliographical references (pages 120-130)Note typebibliography
- Field of study: Materials science and engineering