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In this work, a highly sensitive strain sensing technique is developed to realize in-plane strain mapping for microelectronic packages or emerging flexible or foldable devices, where mechanical or thermal strain

In this work, a highly sensitive strain sensing technique is developed to realize in-plane strain mapping for microelectronic packages or emerging flexible or foldable devices, where mechanical or thermal strain is a major concern that could affect the performance of the working devices or even lead to the failure of the devices. Therefore strain sensing techniques to create a contour of the strain distribution is desired.

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    Date Created
    • 2014
    Resource Type
  • Text
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    Note
    • Partial requirement for: Ph.D., Arizona State University, 2014
      Note type
      thesis
    • Includes bibliographical references (p. 74-84)
      Note type
      bibliography
    • Field of study: Electrical engineering

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    by Hanshuang Liang

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