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ABSTRACT Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of

ABSTRACT Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of more transistors, higher power, smaller size, lighter weight and even bendability, thermal management of these devices became one of the key challenges. Compared to active heat management system, heat pipe, which is a passive fluidic system, is considered promising to solve this problem. However, traditional heat pipes have size, weight and capillary limitation.

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    Date Created
    • 2014
    Resource Type
  • Text
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    • Partial requirement for: M.S., Arizona State University, 2014
      Note type
      thesis
    • Includes bibliographical references (p. 53-56)
      Note type
      bibliography
    • Field of study: Mechanical engineering

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    by Tianwei Sun

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