Description
In this dissertation, remote plasma interactions with the surfaces of low-k interlayer dielectric (ILD), Cu and Cu adhesion layers are investigated. The first part of the study focuses on the simultaneous plasma treatment of ILD and chemical mechanical polishing (CMP) Cu surfaces using N2/H2 plasma processes.
Download count: 0
Details
Contributors
- Liu, Xin (Author)
- Nemanich, Robert (Thesis advisor)
- Chamberlin, Ralph (Committee member)
- Chen, Tingyong (Committee member)
- Smith, David (Committee member)
- Ponce, Fernando (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2012
Subjects
Resource Type
Collections this item is in
Note
- Partial requirement for: Ph.D., Arizona State University, 2012Note typethesis
- Includes bibliographical references (p. 106-112)Note typebibliography
- Field of study: Physics
Citation and reuse
Statement of Responsibility
by Xin Liu