Description

Pb-free solder joints are commonly used as interconnects in semiconductor packaging. One of the major defects affecting the mechanical performance of solder joints are reflow pores that form during processing.

Pb-free solder joints are commonly used as interconnects in semiconductor packaging. One of the major defects affecting the mechanical performance of solder joints are reflow pores that form during processing. These pores exhibit significant variability in size and distribution, and understanding the effects of pore geometry on failure is an important reliability concern. In this thesis, the pore microstructures of solder joint samples and the localized plastic deformation around individual pores was characterized in 3D using lab scale X-ray Microtomography.

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    Date Created
    • 2012
    Resource Type
  • Text
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    Note
    • Partial requirement for: M.S., Arizona State University, 2012
      Note type
      thesis
    • Includes bibliographical references (p. 59-63)
      Note type
      bibliography
    • Field of study: Materials science and engineering

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    by Eric Padilla

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