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One of the challenges in future semiconductor device design is excessive rise of power dissipation and device temperatures.

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    Date Created
    2011
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  • Text
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    Note
    • Partial requirement for: Ph.D., Arizona State University, 2011
      Note type
      thesis
    • Includes bibliographical references (p.105-116)
      Note type
      bibliography
    • Field of study: Electrical engineering

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    by Arif Hossain

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