Temporary bonding-debonding of flexible plastic substrates to rigid carriers may facilitate effective substrate handling by automated tools for manufacture of flexible microelectronics. The primary challenges in implementing practical temporary bond-debond technology originate from the stress that is developed during high temperature processing predominately through thermal-mechanical property mismatches between carrier, adhesive and substrate.
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- Partial requirement for: Ph.D., Arizona State University, 2011Note typethesis
- Includes bibliographical referencesNote typebibliography
- Field of study: Chemical engineering