The data and results presented in this paper are part of a continuing effort to innovate and pioneer the future of engineering. The purpose of the following is to demonstrate the mechanical buckling characteristics in stiff thin film and soft substrate systems, and the importance of controlling them. In today's engineering research, wrinkling in systems in beginning to be viewed as a means for engineering innovation rather than failure. This research is important to further progress the possible applications the technology proposes, such as flexible electronics and tunable adhesives.
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