An Effective Characterization Methodology for Sub-Micron Copper Oxidation and Oxide-Preventing Surface Finishes with a short essay on The Effects of Lead during Product Lifecycle, Impact on the Environment and Alternatives to Leaded Solder

The transition to lead-free solder in the electronics industry has benefitted the environment in many ways. However, with new materials systems comes new materials issues. During the processing of copper pads, a protective surface treatment is needed to prevent the copper from oxidizing.